Solid-state imaging device and imaging apparatus having circuit elements in plurality of semicondcutor substrates configured in a stacked structure

1. A solid-state imaging device having circuit elements configuring a plurality of pixels, wherein the circuit elements are distributed in a plurality of semiconductor substrates configured in a stacked structure, the solid-state imaging device comprising:

a first semiconductor substrate having a plurality of photoelectric conversion circuits forming a two-dimensional array, each of the plurality of photoelectric conversion circuits having a part of the circuit elements including a photoelectric conversion element configured to transform incident light to an electrical signal;

a second semiconductor substrate having a plurality of signal processing circuits forming a two-dimensional array, each of the plurality of signal processing circuits having another part of the circuits elements configured to process the electrical signal output by the plurality of photoelectric conversion circuits, and a number of the plurality of signal processing circuits being equal to a number of the plurality of photoelectric conversion circuits; and

a plurality of connection electrodes formed in a two-dimensional array between the first semiconductor substrate and the second semiconductor substrate and configured to electrically connect signal lines of the plurality of photoelectric conversion circuits and signal lines of the plurality of signal processing circuits respectively,

wherein a pixel set is defined by including at least one of the plurality of photoelectric conversion circuits, and

wherein each of the plurality of photoelectric circuits included in the pixel sets adjacent to each other is connected to one of the plurality of signal processing circuits via separated connection electrodes which are not adjacent to each other among the plurality of connection electrodes, respectively.

2. The solid-state imaging device according to claim 1 ,

wherein the pixel set is configured by including multiple photoelectric conversion circuits among the plurality of photoelectric conversion circuits in which the photoelectric conversion elements are adjacent to each other, and

wherein the multiple photoelectric conversion circuits included in the pixel set are connected to one corresponding signal processing circuit via the connection electrodes adjacent to each other, respectively.

3. The solid-state imaging device according to claim 2 ,

wherein the plurality of connection electrodes are formed in correspondence with the plurality of pixel sets respectively, and

wherein the multiple photoelectric conversion circuits included in the same pixel set are connected to the corresponding signal processing circuits via one of the plurality of connection electrodes.

4. The solid-state imaging device according to claim 1 ,

wherein the pixel set is configured by including multiple photoelectric conversion circuits among the plurality of photoelectric conversion circuits in which the photoelectric conversion elements are adjacent to each other, the photoelectric conversion elements being configured to transform light having different wavelengths into the electrical signal, and

wherein the multiple photoelectric conversion circuits included in the pixel set are connected to the corresponding signal processing circuits via the connection electrodes adjacent to each other, respectively.

5. The solid-state imaging device according to claim 1 , wherein the photoelectric conversion circuits included in the pixel sets adjacent to each other are connected to the corresponding signal processing circuits via the different connection electrodes which are formed at separated positions in either of a row direction or a column direction adjacent to the photoelectric conversion circuits, respectively.

6. The solid-state imaging device according to claim 5 ,

wherein a connection unit is defined by including a predetermined number of the pixel sets, and

wherein each of the photoelectric conversion circuits included in the pixel sets adjacent to each other is connected to the corresponding signal processing circuit via separated connection electrodes which are not adjacent to each other among the plurality of connection electrodes by a cycle of the connection unit.

7. The solid-state imaging device according to claim 6 ,

wherein the connection unit has multiple variations in either of the row direction or the column direction in which the pixel sets are adjacent to each other, and

wherein the multiple variations of the connection unit are periodically repeated in either of the row direction or the column direction, respectively.

8. The solid-state imaging device according to claim 7 , wherein the connection units are different by each row or each column in which the photoelectric conversion element included in each photoelectric conversion circuit in the first semiconductor substrate is formed.

9. The solid-state imaging device according to claim 1 , wherein a plurality of image signals according to a plurality of the electrical signals which are processed by the plurality of signal processing circuits connected to the plurality of photoelectric conversion circuits respectively are output in a sequence same as a sequence in which the photoelectric conversion elements formed in the first semiconductor substrate are queued.

10. An imaging apparatus, comprising:

the solid-state imaging device according to claim 1 , and

a processor configured to rearrange image signals output from the solid-state imaging device in a sequence in which a plurality of the photoelectric conversion elements are queued, the plurality of the photoelectric conversion elements being configured to transform light incident on the solid-state imaging device to electrical signals for generating the image signals.