IP Library › Granted Patent US 10,648,719
Granted Patent B2
US 10,648,719 · App. 16/163,855 · Granted May 12, 2020

Heating, ventilating, air conditioning, and refrigeration system with simultaneous sub-cooling and superheat control

Inventors: Dhaman K. Besarla (Leander, TX); Colin B. Bingle (Austin, TX); Kevin C. Sinkar (Austin, TX); Eric S. Shea (Austin, TX)
Assignee: Dunan Microstaq, Inc.
F25B49/02F25B40/02F25B40/06F25B41/04F25B41/062F25B2600/19F25B2600/21F25B2600/2513F25B2700/197F25B2700/21163F25B2700/21175
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Quick Facts
Patent No.
US 10,648,719
App. No.
16/163,855
Granted
May 12, 2020
Kind
B2
Abstract

A method of controlling fluid flow through a heating, ventilating, air conditioning, and refrigeration (HVAC-R) system includes measuring temperature and pressure at an outlet of an evaporator of the HVAC-R system, wherein the evaporator is in fluid communication with a compressor, a condenser, an expansion device between the evaporator and the condenser, and a flow control valve between the compressor and the condenser, and measuring a sub-cooling temperature at an outlet of the condenser. The measured evaporator temperature and pressure data is sent to a first superheat processor, and the measured sub-cooling temperature data is send to a second superheat processor. A control signal to the expansion device from the first superheat processor and a control signal to the flow control valve from the second superheat processor are then simultaneously sent.

Claims (32)

1. A method of controlling fluid flow through a heating, ventilating, air conditioning, and refrigeration (HVAC-R) system comprising:

measuring temperature and pressure at an outlet of an evaporator of the HVAC-R system, wherein the evaporator is in fluid communication with a compressor, a condenser, an expansion device between the evaporator and the condenser, and a flow control valve between the compressor and the condenser;

measuring a sub-cooling temperature at an outlet of the condenser;

sending the measured evaporator temperature and pressure data to a first superheat processor;

sending the measured sub-cooling temperature data to a second superheat processor; and

simultaneously sending a control signal to the expansion device from the first superheat processor and a control signal to the flow control valve from the second superheat processor.

2. The method according to claim 1 , wherein the control signal from the first superheat processor to the expansion device is configured to ensure a stable mass flow rate of the refrigerant fluid traveling into the evaporator.

3. The method according to claim 1 , wherein the control signal from the second superheat processor to the flow control valve is configured to ensure a stable sub-cooling value of the refrigerant fluid traveling into the condenser.

4. The method according to claim 1 , wherein the expansion device is a modular silicon expansion valve.

5. The method according to claim 1 , wherein the flow control valve is an adjustable high pressure control valve.

6. The method according to claim 4 , wherein the modular silicon expansion valve is a two-stage proportional control valve, wherein a first stage is a microvalve configured as a pilot valve to control a second stage spool valve, wherein when the microvalve receives a Pulse Width Modulation (PWM) signal from a superheat processor operatively connected to the superheat controller, the microvalve modulates to change a pressure differential across the second stage spool valve, and wherein the spool valve will move to balance the pressure differential, changing an orifice opening of the modular silicon expansion valve to control a desired amount of refrigerant flow.

7. The method according to claim 1 , wherein the first superheat processor is an integrated component of a superheat controller and electrically connected to the superheat controller.

8. The method according to claim 7 , wherein the superheat controller includes an integrated pressure sensor.

9. The method according to claim 8 , wherein the superheat controller includes an integrated temperature sensor.

10. The method according to claim 1 , wherein the second superheat processor is an integrated component of a sub-cooling controller and electrically connected to the sub-cooling controller.

11. The method according to claim 10 , wherein the sub-cooling controller includes an integrated pressure sensor.

12. The method according to claim 11 , wherein the sub-cooling controller includes an integrated temperature sensor.

13. The method according to claim 9 , further including one of a temperature sensor, a computer, a cell phone, and a memory card, mounted externally to the superheat controller and electrically connected thereto.

14. The method according to claim 13 , further including the step of sending data from the one of a temperature sensor, a computer, a cell phone, and a memory card to the superheat processor.

15. The method according to claim 12 , further including one of a temperature sensor, a computer, a cell phone, and a memory card, mounted externally to the sub-cooling controller and electrically connected thereto.

16. The method according to claim 15 , further including the step of sending data from the one of a temperature sensor, a computer, a cell phone, and a memory card to the sub-cooling processor.

17. A heating, ventilating, air conditioning, and refrigeration (HVAC-R) system comprising:

an evaporator;

a compressor;

a condenser;

an expansion device between the condenser and the evaporator;

a flow control valve between the compressor and the condenser;

a sub-cooling controller between the condenser and the expansion device, the sub-cooling controller configured to measure refrigerant fluid temperature at an outlet of the condenser and calculate sub-cooling therefrom, and further configured to provide a control signal to the flow control valve; and

a superheat controller between the evaporator and the compressor, the superheat controller configured to measure refrigerant fluid pressure and temperature and to calculate superheat therefrom, and further configured to provide a control signal to the expansion device.

18. The HVAC-R system according to claim 17 , wherein the expansion valve is a modular silicon expansion valve.

19. The HVAC-R system according to claim 17 , wherein the flow control valve is an adjustable high pressure control valve.

20. The HVAC-R system according to claim 18 , wherein the modular silicon expansion valve is a two-stage proportional control valve, wherein a first stage is a microvalve configured as a pilot valve to control a second stage spool valve, wherein when the microvalve receives a Pulse Width Modulation (PWM) signal from a superheat processor operatively connected to the superheat controller, the microvalve modulates to change a pressure differential across the second stage spool valve, and wherein the spool valve will move to balance the pressure differential, changing an orifice opening of the modular silicon expansion valve to control a desired amount of refrigerant flow.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2026
From: DUNAN MICROSTAQ, INC.
To: DUNAN PRECISION, INC.
Reel/Frame 076014/0181 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2018
From: BESARLA, DHAMAN K.; BINGLE, COLIN B.; SINKAR, KEVIN C.; SHEA, ERIC S.
To: DUNAN MICROSTAQ, INC.
Reel/Frame 047301/0473 →
Continuity (2)
Provisional Application 62598492 · Dec 14, 2017
Related Publication 20190186800A1 · Jun 20, 2019