Polishing with measurement prior to deposition of outer layer

1. A computer program product, encoded on one or more non-transitory computer storage media, comprising instructions that when executed by one or more computers cause the one or more computers to perform operations comprising:

storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer;

after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate by a polishing system, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system;

normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement;

determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements; and

at least one of causing the polishing system to halt polishing at the polishing endpoint or causing the polishing system to adjust the polishing rate by the adjustment.

2. The computer program product of claim 1 , wherein the raw measurement comprises a raw spectrum and the base measurement comprises a base spectrum received from an optical monitoring system.

3. The computer program product of claim 1 , wherein the raw measurement comprises a raw eddy current measurement and the base measurement comprises a base eddy current value from an eddy current monitoring system.

4. The computer program product of claim 1 , wherein the base measurement comprises a measurement of the substrate after deposition of the at least one layer but before an etching process of the at least one layer.

5. The computer program product of claim 1 , wherein the base measurement comprises a measurement of the substrate after an etching process of the at least one layer but before deposition of an intermediate layer over the at least one layer.

6. The computer program product of claim 1 , wherein the base measurement comprises a measurement of the substrate after deposition of an intermediate layer over the at least one layer but before depositing the outer layer to undergo polishing.

7. The computer program product of claim 1 , wherein the operations further comprise generating a sequence of values from the sequence of measurements, fitting a function to the sequence of values, determining a projected time at which the function reaches a target value, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.

8. The computer program product of claim 1 , wherein normalizing includes a division operation in which the raw measurement is in the numerator and the base measurement is in the denominator.

9. The computer program product of claim 8 , wherein the division operation comprises calculating

R

=

A

-

D

A

B

-

D

B

where R is the normalized measurement, A is the raw measurement, B is the base measurement and DA and DB are measurements made by the in-situ monitoring system when no substrate is being measured by the in-situ monitoring system.

10. A method of fabricating a substrate comprising:

depositing a plurality of layers on a substrate, the plurality of layers including at least one underlying layer and at least one outer layer;

making a base measurement of a substrate, the base measurement being a measurement of a substrate after deposition of the at least one underlying layer and before deposition of the outer layer;

after depositing the outer layer, polishing the outer layer;

during polishing of the outer conductive layer, making a sequence of raw measurements of the substrate with an in-situ monitoring system;

normalizing each raw measurement in the sequence of raw measurements to generate a sequence of normalized measurements using the raw measurement and the base measurement; and

determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized measurements.

11. The method of claim 10 , wherein the at least one underlying layer comprises a dielectric layer and the outer layer comprises a conductive layer.

12. The method of claim 11 , wherein the sequence of raw measurements comprises a sequence of eddy current values measured by an eddy current monitoring system and the base measurement comprises a base eddy current value.

13. The method of claim 10 , wherein the at least one underlying layer comprises a conductive layer and the outer layer comprises a dielectric layer.

14. The method of claim 13 , wherein the sequence of raw measurements comprises a sequence of spectra measured by an optical monitoring system and the base measurement comprises a base spectrum.

15. The method of claim 10 , wherein the base measurement is made after deposition of the at least one layer but before an etching process of the at least one layer.

16. The method of claim 10 , wherein the base measurement is made after an etching process of the at least one layer but before deposition of an intermediate layer over the at least one layer.

17. The method of claim 10 , wherein the base measurement is made after deposition of an intermediate layer over the at least one layer but before depositing the outer layer to undergo polishing.