Apparatus and method of three dimensional conductive lines
An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
1. An inter-tier memory column, comprising:
a first bit line, comprising:
a first segment disposed within a first tier of a three-dimensional integrated circuit (3D IC)
a second segment disposed within a second tier of said 3D IC disposed along a second axis horizontally offset from a first axis,
wherein said first segment is electrically connected to said second segment by a first conductive member extending continuously from said first segment to said second segment; and
a second bit line comprising:
a third segment disposed within said first tier of said 3D IC along a third axis parallel to said second axis; and
a fourth segment disposed within said second tier of said 3D IC along a fourth axis parallel to said first axis, wherein said third segment is electrically connected to said fourth segment by a second conductive member extending continuously from said third segment to said fourth segment.
2. The inter-tier memory column of claim 1 , wherein said first axis and said second axis are parallel.
3. The inter-tier memory column of claim 1 , further comprising an inter-tier word line connected across said first segment and said second segment.
4. The inter-tier memory column of claim 1 , comprising:
a first bit line bar comprising:
a first bar segment disposed within said first tier of said 3D IC; and
a second bar segment horizontally offset from said first bar segment.
5. The inter-tier memory column of claim 4 , comprising:
a second bit line bar comprising:
a third bar segment disposed within said second tier of said 3D IC; and
a fourth bar segment perpendicular to said third bar segment,
wherein said horizontally offset second bar segment and said perpendicular fourth bar segment are connected by a vertical bit line.
6. The inter-tier memory column of claim 1 , further comprising:
a third bit line comprising a fifth segment disposed in said first tier of said 3D IC along a fifth axis and a sixth segment connected to said fifth segment and horizontally offset from said fifth axis; and
a fourth bit line comprising a seventh segment disposed in said second tier of said 3D IC along a seventh axis and an eighth segment connected to said seventh segment and disposed perpendicular to said seventh axis.
7. The inter-tier memory column of claim 6 , wherein said third bit line is electrically connected to said fourth bit line by a conductive member extending continuously from said third bit line to said fourth bit line.
8. The inter-tier memory column of claim 1 , comprising a first conductive extender coupling said first segment to said second segment.
9. The inter-tier memory column of claim 8 , wherein said first coupling extender is disposed perpendicular to said first axis.
10. An inter-tier memory column, comprising:
a first bit line, comprising:
a first segment disposed within a first tier of a three-dimensional integrated circuit (3D IC)
a second segment disposed within a second tier of said 3D IC disposed along a second axis horizontally offset from a first axis;
a first plurality of memory cells electrically connected to said first bit line;
a second bit line comprising:
a third segment disposed within said first tier of said 3D IC along a third axis parallel to said second axis; and
a fourth segment disposed within said second tier of said 3D IC along a fourth axis parallel to said first axis; and
a second plurality of memory cells electrically connected to said second bit line;
wherein said first segment is electrically connected to said second segment by a first conductive member extending continuously from said first segment to said second segment, and wherein said third segment is electrically connected to said fourth segment by a second conductive member extending continuously from said third segment to said fourth segment.
11. The inter-tier memory column of claim 10 , wherein said first axis and said second axis are parallel.
12. The inter-tier memory column of claim 10 , further comprising an inter-tier word line connected across said first segment and said second segment.
13. The inter-tier memory column of claim 10 , comprising:
a first bit line bar comprising:
a first bar segment disposed within said first tier of said 3D IC; and
a second bar segment horizontally offset from said first bar segment; and
a second bit line bar comprising:
a third bar segment disposed within said second tier of said 3D IC; and
a fourth bar segment perpendicular to said third bar segment,
wherein said horizontally offset second bar segment and said perpendicular fourth bar segment are connected by a vertical bit line.
14. The inter-tier memory column of claim 10 , further comprising:
a third bit line comprising a fifth segment disposed in said first tier of said 3D IC along a fifth axis and a sixth segment connected to said fifth segment and horizontally offset from said fifth axis; and
a fourth bit line comprising a seventh segment disposed in said second tier of said 3D IC along a seventh axis and an eighth segment connected to said seventh segment and disposed perpendicular to said seventh axis.
15. The inter-tier memory column of claim 14 , wherein said third bit line is electrically connected to said fourth bit line by a conductive member extending continuously from said third bit line to said fourth bit line.
16. The inter-tier memory column of claim 10 , comprising a first conductive extender coupling said first segment to said second segment, wherein said first coupling extender is disposed perpendicular to said first axis.
17. A method of forming an inter-tier memory column, comprising:
forming a first bit line comprising a first segment disposed within a first tier of a three-dimensional integrated circuit (3D IC) and a second segment disposed within a second tier of said 3D IC disposed along a second axis horizontally offset from a first axis;
forming a second bit line comprising a third segment disposed within said first tier of said 3D IC along a third axis parallel to said second axis and a fourth segment disposed within said second tier of said 3D IC along a fourth axis parallel to said first axis; and
connecting said first segment to said second segment with a first vertical conductive element.
18. The method of claim 17 , wherein said first vertical conductive element extends continuously from said first segment to said second segment.
19. The method of claim 17 further comprising:
forming a first bit line bar comprising a first bar segment disposed within said first tier of said 3D IC and a second bar segment horizontally offset from said first bar segment;
forming a second bit line bar comprising a third bar segment disposed within said second tier of said 3D IC and a fourth bar segment perpendicular to said third bar segment; and
connecting said first bit line bar to said second bit line bar with a second vertical conductive element.
20. The method of claim 17 , further comprising forming an inter-tier word line which connects the first bit line and the second bit line.