Signal isolator having bidirectional communication between die
Methods and apparatus for bi-directional communication between first and second die of a signal isolator for feedback and/or diagnostic signals. In embodiments, the first and second die can be matched.
1. A device, comprising:
a first die; and
a second die with a voltage barrier region between the first and second die,
wherein transmit and receive paths of the first and second dies provide data transfer and bi-directional communication between the first and second die for feedback and/or diagnostic signals,
wherein the first and second dies are substantially identical and rotated one-hundred and eighty degrees with respect to each other,
wherein the transmit path comprises, in order, a first transmitter bridge, a first coil, a first voltage isolation barrier and a first magnetic sensing element and the receive path comprising, in order, a second magnetic sensing element, a second voltage isolation barrier, a second coil, and a second transmitter bridge.
2. The device according to claim 1 , wherein the first transmitter bridge is located on or about the first die, the first coil is located on or about the second die, and the first magnetic sensing element is located on or about the second die.
3. The device according to claim 1 , wherein the magnetic sensing element of the ordered transmit path comprises a magnetoresistive (MR) element.
4. The device according to claim 1 , wherein the magnetic sensing element of the ordered transmit path comprises a giant magnetoresistive (GMR) element.
5. The device according to claim 1 , wherein the magnetic sensing element of the ordered transmit path comprises a tunneling magnetoresistive (TMR) element.
6. The device according to claim 1 , wherein the transmit and receive paths are programmable to transfer information in either direction.
7. The device according to claim 1 , wherein the first die is disposed on a first leadframe portion and the second die is disposed on a second leadframe portion, wherein the first and second leadframe portions are physically separated and electrically isolated from each other.
8. The device according to claim 7 , wherein the first leadframe portion includes a dimple array on which the first die is disposed.
9. The device according to claim 1 , wherein the device comprises an IC package.
10. The device according to claim 1 , wherein the first coil is wirebonded to the first bridge.
11. The device according to claim 10 , wherein the second transmitter bridge is located on or about the second die, the second coil is located on or about the first die, and the second magnetic sensing element is located on or about the first die.
12. The device according to claim 10 , wherein the transmit path of the first die comprises the first transmitter bridge, and the transmit path of the second die comprises the first coil and the first magnetic sensing element.
13. The device according to claim 1 , further including a split die paddle in which a leadframe includes a first portion on which the first die is disposed and a second portion on which the second die is disposed.
14. A device comprising:
a first die;
a second die; and
a voltage barrier means between the first and second die; and
an encoding/decoding means for providing transmit and receive paths between the first and second sets of input/output pins, wherein the transmit and receive paths of the first and second dies provide data transfer and bi-directional feedback and/or diagnostic signal transfer between the first and second die,
wherein the first and second dies are substantially identical and rotated one-hundred and eighty degrees with respect to each other,
wherein the transmit path comprises, in order, a first transmitter bridge, a first coil, a first voltage isolation barrier and a first magnetic sensing element and the receive path comprises, in order, a second magnetic sensing element, a second voltage isolation barrier, a second coil, and a second transmitter bridge.
15. The device according to claim 14 , wherein the first magnetic sensing element of the ordered transmit path comprises a magnetoresistive (MR) element.
16. The device according to claim 14 , further including a leadframe including a first leadframe portion having a dimple array on which the first die is disposed.
17. The device according to claim 14 , further including a split die paddle in which a leadframe includes a first portion on which the first die is disposed and a second portion on which the second die is disposed.
18. A method, comprising:
employing a first die;
employing a second die;
configuring the first and second dies for a voltage barrier region between the first and second dies; and
selectively configuring transmit and receive paths of the first and second dies to provide data transfer and bi-directional feedback and/or diagnostic signal transfer between the first and second die,
wherein the first and second dies are substantially identical and rotated one-hundred and eighty degrees with respect to each other,
wherein the transmit path comprises, in order, a first transmitter bridge, a first coil, a first voltage isolation barrier and a first magnetic sensing element and the receive path comprises, in order, a second magnetic sensing element, a second voltage isolation barrier, a second coil, and a second transmitter bridge.
19. The method according to claim 18 , wherein the first magnetic sensing element of the ordered transmit path comprises a magnetoresistive (MR) element.
20. The method according to claim 18 , wherein the first transmitter bridge is located on or about the first die, the first coil is located on or about the second die, and the first magnetic sensing element is located on or about the second die.
21. The method according to claim 20 , wherein the second transmitter bridge is located on or about the second die, the second coil is located on or about the first die, and the second magnetic sensing element is located on or about the first die.
22. The method according to claim 18 , wherein the transmit path of the first die comprises the first transmitter bridge, and the transmit path of the second die comprises the first coil and the first magnetic sensing element.
23. The method according to claim 18 , further including employing a split die paddle in which a leadframe includes a first portion on which the first die is disposed and a second portion on which the second die is disposed.
24. A device, comprising:
a first die; and
a second die with a voltage barrier region between the first and second die,
wherein transmit and receive paths of the first and second dies provide data transfer and bi-directional communication between the first and second die for feedback and/or diagnostic signals,
wherein the transmit path comprises, in order, a first transmitter bridge, a first coil, a first voltage isolation barrier and a first magnetic sensing element and the receive path comprises, in order, a second magnetic sensing element, a second voltage isolation barrier, a second coil, and a second transmitter bridge, and
wherein the first die includes the first transmitter bridge, the second die includes the first coil, and the second die includes the first magnetic sensing element.
25. The device according to claim 24 , wherein the first and second dies are substantially identical and rotated one-hundred and eighty degrees with respect to each other.
26. The device according to claim 24 , wherein the first magnetic sensing element of the ordered transmit path comprises a magnetoresistive (MR) element.
27. The device according to claim 24 , wherein the first magnetic sensing element of the ordered transmit path comprises a giant magnetoresistive (GMR) element.
28. The device according to claim 24 , wherein the first magnetic sensing element of the ordered transmit path comprises a tunneling magnetoresistive (TMR) element.
29. The device according to claim 24 , wherein the transmit path and the receive path are programmable to transfer information in either direction.
30. The device according to claim 24 , wherein the first die is disposed on a first leadframe portion and the second die is disposed on a second leadframe portion, wherein the first and second leadframe portions are physically separated and electrically isolated from each other.
31. The device according to claim 30 , wherein the first leadframe portion includes a dimple array on which the first die is disposed.
32. The device according to claim 24 , wherein the device comprises an IC package.
33. The device according to claim 24 , wherein the first coil is wirebonded to the first die.
34. The device according to claim 24 , wherein the first transmitter bridge is located on or about the first die, the first coil is located on or about the second die, and the first magnetic sensing element is located on or about the second die.
35. The device according to claim 24 , wherein the second transmitter bridge is located on or about the second die, the second coil is located on or about the first die, and the second magnetic sensing element is located on or about the first die.
36. A device comprising:
a first die;
a second die; and
a voltage barrier means between the first and second die; and
an encoding/decoding means for providing transmit and receive paths between the first and second sets of input/output pins, wherein the transmit and receive paths of the first and second dies provide data transfer and bi-directional feedback and/or diagnostic signal transfer between the first and second die,.
wherein the transmit path comprises, in order, a first transmitter bridge, a first coil, a first voltage isolation barrier and a first magnetic sensing element and the receive path comprises, in order, a second magnetic sensing element, a second voltage isolation barrier, a second coil, and a second transmitter bridge, and
wherein the first die includes the first transmitter bridge, the second die includes the first coil, and the second die includes the first magnetic sensing element.
37. The device according to claim 36 , wherein the first and second dies are substantially identical and rotated one-hundred and eighty degrees with respect to each other.
38. The device according to claim 36 , wherein the first magnetic sensing element of the ordered transmit path comprises a magnetoresistive (MR) element.
39. The device according to claim 36 , wherein the first magnetic sensing element of the ordered transmit path comprises a giant magnetoresistive (GMR) element.
40. The device according to claim 36 , wherein the first magnetic sensing element of the ordered transmit path comprises a tunneling magnetoresistive (TMR) element.
41. The device according to claim 36 , wherein the transmit path and the receive path are programmable to transfer information in either direction.
42. The device according to claim 36 , wherein the first die is disposed on a first leadframe portion and the second die is disposed on a second leadframe portion, wherein the first and second leadframe portions are physically separated and electrically isolated from each other.
43. The device according to claim 42 , wherein the first leadframe portion includes a dimple array on which the first die is disposed.
44. The device according to claim 36 , wherein the device comprises an IC package.
45. The device according to claim 36 , wherein the first coil is wirebonded to the first die.
46. The device according to claim 36 , wherein the first transmitter bridge is located on or about the first die, the first coil is located on or about the second die, and the first magnetic sensing element is located on or about the second die.
47. The device according to claim 36 , wherein the second transmitter bridge is located on or about the second die, the second coil is located on or about the first die, and the second magnetic sensing element is located on or about the first die.
48. A method, comprising:
employing a first die;
employing a second die;
configuring the first and second dies for a voltage barrier region between the first and second dies; and
selectively configuring the transmit and receive paths of the first and second dies to provide data transfer and bi-directional feedback and/or diagnostic signal transfer between the first and second die,
wherein the transmit path comprises, in order, a first transmitter bridge, a first coil, a first voltage isolation barrier and a first magnetic sensing element and the receive path comprises, in order, a second magnetic sensing element, a second voltage isolation barrier, a second coil, and a second transmitter bridge, and
wherein the first die includes the first transmitter bridge, the second die includes the first coil, and the second die includes the first magnetic sensing element.
49. The method according to claim 48 , wherein the first and second dies are substantially identical and rotated one-hundred and eighty degrees with respect to each other.
50. The method according to claim 48 , wherein the first magnetic sensing element of the ordered transmit path comprises a magnetoresistive (MR) element.
51. The method according to claim 48 , wherein the first magnetic sensing element of the ordered transmit path comprises a giant magnetoresistive (GMR) element.
52. The method according to claim 48 , wherein the first magnetic sensing element of the ordered transmit path comprises a tunneling magnetoresistive (TMR) element.
53. The method according to claim 48 , wherein the transmit path and the receive path are programmable to transfer information in either direction.
54. The method according to claim 48 , wherein the first die is disposed on a first leadframe portion and the second die is disposed on a second leadframe portion, wherein the first and second leadframe portions are physically separated and electrically isolated from each other.
55. The method according to claim 54 , wherein the first leadframe portion includes a dimple array on which the first die is disposed.
56. The method according to claim 48 , wherein the device comprises an IC package.
57. The method according to claim 48 , wherein the first coil is wirebonded to the first die.
58. The method according to claim 48 , wherein the first transmitter bridge is located on or about the first die, the first coil is located on or about the second die, and the first magnetic sensing element is located on or about the second die.
59. The method according to claim 48 , wherein the second transmitter bridge is located on or about the second die, the second coil is located on or about the first die, and the second magnetic sensing element is located on or about the first die.