IP Library Granted Patent US 10,651,272
Granted Patent B2
US 10,651,272 · App. 15/902,333 · Granted May 12, 2020

Semiconductor device and full-wave rectifier circuit

Inventor: Katsuyoshi Matsuura (Kuwana, JP)
Assignee: UNITED SEMICONDUCTOR JAPAN CO., LTD.
H01L29/0692H01L27/0814H01L29/0607H01L29/0649H01L29/66136H01L29/861H01L29/8611H02M7/06
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Quick Facts
Patent No.
US 10,651,272
App. No.
15/902,333
Granted
May 12, 2020
Kind
B2
Abstract

One aspect of a semiconductor device includes a plurality of first structures, in which each of the first structures includes: a first N-type region; a P-type region which is surrounded by the first N-type region; and a second N-type region which is surrounded by the P-type region. The first N-type region and the P-type region are wired, and the plurality of first structures are connected in parallel to form one diode.

Claims (35)

1. A semiconductor device, comprising

a plurality of first structures, wherein:

each of the first structures includes:

a first N-type region;

a P-type region which is surrounded by the first N-type region; and

a second N-type region which is surrounded by the P-type region;

a plurality of the first N-type region and a plurality of the P-type region are mutually wired in common between the plurality of first structures as an anode by a wire;

a plurality of the second N-type regions are mutually wired in common between the plurality of first structures as a cathode by the wire; and

the plurality of first structures are connected in parallel to form one diode.

2. The semiconductor device according to claim 1 , wherein

a part of the first N-type region is shared between adjacent first structures in the plurality of first structures.

3. The semiconductor device according to claim 1 , further comprising

four diodes which are connected in a bridge configuration to form a full-wave rectifier circuit, wherein at least one of the four diodes includes the plurality of first structures.

4. The semiconductor device according to claim 3 , wherein the four diodes include the plurality of first structures.

5. The semiconductor device according to claim 3 , wherein a frequency of an input signal to the bridge configuration is 10 MHz or more.

6. A semiconductor device, comprising

a first structure, wherein:

the first structure includes:

a first N-type region;

a first P-type region which is surrounded by the first N-type region; and

a second N-type region which is surrounded by the first P-type region;

a second structure, wherein:

the second structure includes:

a third N-type region;

a second P-type region which is surrounded by the third N-type region; and

a fourth N-type region which is surrounded by the second P-type region;

wherein:

the first N-type region, the first P-type region, the third N-type region and the second P-type region are mutually wired in common between the first structure and the second structure as an anode by a wire;

the second N-type region and the fourth N-type region are mutually wired in common between the first structure and the second structure as a cathode by the wire; and

the first structure and the second structure are connected in parallel to form a diode.

7. The semiconductor device according to claim 6 , wherein a part of the first N-type region and a part of the third N-type region is shared between the first structures and the second structure.

8. The semiconductor device according to claim 6 , further comprising

four diodes which are connected in a bridge configuration to form a full-wave rectifier circuit, wherein at least one of the four diodes includes the first structure and the second structure.

9. The semiconductor device according to claim 8 , wherein the four diodes include the first structure and the second structure.

10. The semiconductor device according to claim 8 , wherein a frequency of an input signal to the bridge configuration is 10 MHz or more.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Mar 2, 2020
From: MIE FUJITSU SEMICONDUCTOR LIMITED; UNITED SEMICONDUCTOR JAPAN CO., LTD.
To: UNITED SEMICONDUCTOR JAPAN CO., LTD.
Reel/Frame 052107/0771 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2018
From: MATSUURA, KATSUYOSHI
To: MIE FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 045416/0629 →
Priority Claims (1)
JP 2017-048619 · Mar 14, 2017 · national
Continuity (1)
Related Publication 20180269286A1 · Sep 20, 2018