Radio-frequency module with switch IC having a ground electrode for isolating between a common terminal and selection terminals
A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
1. A radio-frequency module comprising:
a substrate including at least one dielectric layer; and
a switch IC that is mounted on the substrate and that includes a common terminal and a plurality of selection terminals; wherein
the substrate includes a ground electrode disposed in a region between the common terminal and at least one of the plurality of selection terminals in a plan view of the substrate;
a portion of the ground electrode is disposed on the at least one dielectric layer of the substrate;
the ground electrode in the region is not exposed to an outside at a surface of the substrate;
the ground electrode extends from a first side of the common terminal to a second side of the common terminal in the plan view of the substrate; and
the portion of the ground electrode disposed on the at least one dielectric layer does not overlap with the common terminal and the plurality of selection terminals of the switch IC in the plan view of the substrate.
2. The radio-frequency module according to claim 1 , wherein at least a portion of the ground electrode is disposed within the substrate.
3. The radio-frequency module according to claim 1 , wherein at least a portion of the ground electrode extends in a thickness direction of the substrate.
4. The radio-frequency module according to claim 1 , wherein the ground electrode includes a via-electrode extending in a thickness direction of the substrate.
5. The radio-frequency module according to claim 4 , wherein the ground electrode includes a plurality of via-electrodes that are disposed adjacent to the plurality of selection terminals in the plan view of the substrate such that the plurality of via-electrodes are aligned along the plurality of selection terminals in the plan view of the substrate.
6. The radio-frequency module according to claim 5 , wherein the ground electrode includes a wiring pattern which connects at least two of the plurality of via-electrodes.
7. The radio-frequency module according to claim 4 , wherein:
the substrate is a multilayer substrate including a plurality of layers stacked on each other; and
the via-electrode passes through at least one of the plurality of layers.
8. The radio-frequency module according to claim 1 , wherein the region is on a line connecting the common terminal and the at least one of the plurality of selection terminals, in a plan view of the substrate.
9. The radio-frequency module according to claim 1 , further comprising:
a directional coupler; wherein
at least one of the plurality of selection terminals is connected to a coupled port of the directional coupler.
10. The radio-frequency module according to claim 9 , wherein another one of the plurality of selection terminals is connected to another coupled port of the directional coupler.
11. The radio-frequency module according to claim 9 , wherein, in the plan view of the substrate, the ground electrode separates a region at a corner of the substrate where the common terminal is disposed, from a region of the substrate where the plurality of selection terminals and the directional coupler are disposed.
12. The radio-frequency module according to claim 1 , wherein the switch IC is one of a field-effect transistor and a packaged circuit component.
13. The radio-frequency module according to claim 1 , wherein a distance between the common terminal and each of the plurality of selection terminals is about 50 μm to about 150 μm.
14. The radio-frequency module according to claim 1 , further comprising connecting terminals disposed on the substrate at positions that are aligned with positions of the common terminal and the plurality of selection terminals in the plan view of the substrate.
15. The radio-frequency module according to claim 1 , wherein a plurality of ground electrodes are disposed adjacent to the plurality of selection terminals in the plan view of the substrate such that the plurality of the ground electrodes are provided along the plurality of selection terminals; and
the plurality of ground electrodes include the ground electrode.
16. The radio-frequency module according to claim 15 , wherein each of the plurality of ground electrodes has one of a columnar shape, a substantially columnar shape, a cylindrical shape, a substantially cylindrical shape, a plate shape, a substantially plate shape, a rectangular parallelepiped shape, and a substantially rectangular parallelepiped shape.
17. The radio-frequency module according to claim 15 , wherein a distance between adjacent pairs of the plurality of the ground electrodes is about ¼ or less than a wavelength of waves used in the radio-frequency module.
18. The radio-frequency module according to claim 15 , wherein a diameter of each of the plurality of ground electrodes is equal or substantially equal to or greater than a distance between the common terminal and the plurality of selection terminals.
19. The radio-frequency module according to claim 14 , wherein a conductive member defines at least two of the connecting terminals and a wiring pattern, and extends from one main surface to another main surface of the substrate.
20. The radio-frequency module according to claim 15 , wherein each of the plurality of ground electrodes is defined by one of a via-electrode and a wiring pattern.
21. A radio-frequency module comprising:
a substrate including at least one dielectric layer; and
a switch IC that is mounted on the substrate and that includes a common terminal and a plurality of selection terminals; wherein
the substrate includes a ground electrode disposed in a region that is on a line connecting the common terminal and at least one of the plurality of selection terminals in a plan view of the substrate;
a portion of the ground electrode is disposed on the at least one dielectric layer of the substrate;
the ground electrode in the region is not exposed to an outside at a surface of the substrate;
the ground electrode extends from a first side of the common terminal to a second side of the common terminal in the plan view of the substrate; and
the portion of the ground electrode disposed on the at least one dielectric layer does not overlap with the common terminal and the plurality of selection terminals of the switch IC in the plan view of the substrate.