IP Library › Granted Patent US 10,653,050
Granted Patent B2
US 10,653,050 · App. 15/830,020 · Granted May 12, 2020

Electronic module and vehicle having the same

Inventors: SeungHyun Han (Gyeonggi-do, KR); Jongpil Kim (Gyeonggi-do, KR); Yongoh Choi (Gyeongsangnam-do, KR); Wongyu Seol (Gyeongsangnam-do, KR); Se-Kyo Chung (Gyeongsangnam-do, KR)
Assignees: Hyundai Motor Company; Kia Motors Corporation; Industry-Academic Cooperation Foundation Gyeongsang National University
H05K9/0071B60R16/03H01F27/24H01F27/2804H05K1/165H01F2027/2809H05K1/0216H05K1/0298H05K2201/10151
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Quick Facts
Patent No.
US 10,653,050
App. No.
15/830,020
Granted
May 12, 2020
Kind
B2
Abstract

A vehicle electronic module is provided. The vehicle electronic module has a reduced size and improved productivity by replacing a sensor and an offset unit of an electromagnetic interference (EMI) filter module with a printed circuit board (PCB) winding structure. The electronic module includes a sensor that detects EMI noise of a power line and an offset unit that transmits an offset voltage for removing the EMI noise to the power line. A controller is configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor. Then sensor and the offset unit are formed in a stacked structure of the PCB.

Claims (40)

1. An electronic module, comprising:

a sensor configured to detect common mode electromagnetic interference (EMI) noise of a power line;

an offset unit configured to transmit an offset voltage for removing the EMI noise to the power line; and

a controller configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor,

wherein the sensor and the offset unit are formed in a stacked structure of a printed circuit board (PCB).

2. The electronic module according to claim 1 , wherein the offset unit includes:

a first winding configured to receive the offset voltage generated by the controller;

a second winding configured to transform the offset voltage and supply the transformed voltage to the power line; and

a core configured to electrically connect the first winding and the second winding.

3. The electronic module according to claim 2 , wherein the offset unit includes:

a first PCB that forms the first winding;

a second PCB that forms the second winding; and

a third PCB configured to electrically connect the first winding and the second winding.

4. The electronic module according to claim 2 , wherein the controller is disposed on a PCB with the first winding or the second winding.

5. The electronic module according to claim 1 , wherein the controller includes a voltage or current amplifying component that is an operational amplifier or a transistor.

6. The electronic module according to claim 1 , wherein the controller includes a resistor and is configured to generate the offset voltage that corresponds to the EMI noise based on the resistor.

7. The electronic module according to claim 1 , wherein a wiring structure is formed on the PCB based on a turn ratio of the offset unit.

8. The electronic module according to claim 1 , wherein the at least one PCB includes an aperture structure configured to electrically connect the PCB and a second PCB.

9. The electronic module according to claim 1 , further comprising a passive component configured to remove the EMI noise.

10. A vehicle, comprising:

a power source configured to supply power to the vehicle;

a power line configured to transmit the power supplied from the power source to the vehicle;

a sensor configured to detect electromagnetic interference (EMI) noise of the power line;

an offset unit configured to transmit an offset voltage for removing the EMI noise to the power line; and

a controller configured to generate the offset voltage that corresponds to the EMI noise detected by the sensor,

wherein the sensor and the offset unit are formed in a stacked structure of a printed circuit board (PCB).

11. The vehicle according to claim 10 , wherein the offset unit includes:

a first winding configured to receive the offset voltage generated by the controller;

a second winding configured to transform the offset voltage and supply the transformed voltage to the power line; and

a core configured to electrically connect the first winding and the second winding.

12. The vehicle according to claim 11 , wherein the offset unit includes:

a first PCB that forms the first winding;

a second PCB that forms the second winding; and

a third PCB configured to electrically connect the first winding and the second winding.

13. The vehicle according to claim 11 , wherein the controller is disposed on one PCB together with the first winding or the second winding.

14. The vehicle according to claim 10 , wherein the controller includes a voltage or current amplifying component that is an operational amplifier or a transistor.

15. The vehicle according to claim 10 , wherein the controller includes a resistor and is configured to generate the offset voltage that corresponds to the EMI noise based on the at least one resistor.

16. The vehicle according to claim 10 , wherein a wiring structure is formed on the PCB based on a turn ratio of the offset unit.

17. The vehicle according to claim 10 , wherein the PCB includes an aperture structure configured to electrically connect the PCB to a second PCB.

18. The vehicle according to claim 10 , further comprising a passive component configured to remove the EMI noise.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2017
From: HAN, SEUNGHYUN; KIM, JONGPIL; CHOI, YONGOH; SEOL, WONGYU; CHUNG, SE-KYO
To: HYUNDAI MOTOR COMPANY; KIA MOTORS CORPORATION; INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY
Reel/Frame 044282/0911 →
Priority Claims (1)
KR 10-2017-0091288 · Jul 19, 2017 · national
Continuity (1)
Related Publication 20190029148A1 · Jan 24, 2019