Multilayer capacitor having external electrode including conductive resin layer
A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
1. A multilayer capacitor comprising:
a body including dielectric layers and internal electrodes; and
an external electrode disposed on one surface of the body, respectively,
wherein the external electrode includes:
a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; and
a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part;
the metal particles of the conductive resin layer are composed of at least one material selected from a group consisting of copper, nickel, silver, copper coated with silver, and copper coated with tin,
the intermetallic compound is composed of copper-tin,
the body includes first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other,
the internal electrodes are alternately exposed from the third and fourth surfaces of the body,
the first electrode layers are disposed on the third and fourth surfaces of the body to be connected to exposed portions of the internal electrodes, respectively,
the external electrodes include connection parts disposed on the third and fourth surfaces of the body and band parts extended from the connection parts to portions of the first and second surfaces of the body, respectively, and
t 2 /t 1 ≥0.05 and t 3 /t 1 ≤0.5, in which t 1 is a thickness of a central portion of the connection part, t 2 is a thickness of a corner portion, and t 3 is a thickness of a central portion of the band part.
2. The multilayer capacitor of claim 1 , wherein the first electrode layer includes copper.
3. The multilayer capacitor of claim 1 , wherein the conductive connecting part has a melting point lower than a hardening temperature of the base resin.
4. The multilayer capacitor of claim 3 , wherein the melting point of the conductive connecting part is 300° C. or less.
5. The multilayer capacitor of claim 1 , wherein the conductive connecting part of the conductive resin layer includes Ag 3 Sn.
6. The multilayer capacitor of claim 1 , wherein the metal particles have a size of 0.2 μm to 20 μm.
7. The multilayer capacitor of claim 1 , wherein the metal particles of the conductive resin layer are metal particles having spherical shapes, flake-shaped metal particles, or mixtures of metal particles having spherical shapes and flake-shaped metal particles.
8. The multilayer capacitor of claim 1 , wherein a thickness of the intermetallic compound is 2.0 μm to 5.0 μm.
9. The multilayer capacitor of claim 1 , wherein the external electrode further comprises a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
10. A multilayer capacitor comprising:
a body including dielectric layers and internal electrodes; and
an external electrode disposed on one surface of the body, respectively,
wherein the external electrode includes:
a first electrode layer disposed on one surface of the body and contacting the internal electrodes; and
a conductive resin layer disposed on the first electrode layer and including a conductive connecting part including a low-melting-point metal, an intermetallic compound contacting the first electrode layer and the conductive connecting part, and a base resin covering the conductive connecting part and the intermetallic compound,
the intermetallic compound has a form of a plurality of islands,
the body includes first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other,
the internal electrodes are alternately exposed from the third and fourth surfaces of the body,
the first electrode layers are disposed on the third and fourth surfaces of the body to be connected to exposed portions of the internal electrodes, respectively,
the external electrodes include connection parts disposed on the third and fourth surfaces of the body and band parts extended from the connection parts to portions of the first and second surfaces of the body, respectively, and
t 2 /t 1 ≥0.05 and t 3 /t 1 ≤0.5, in which t 1 is a thickness of a central portion of the connection part, t 2 is a thickness of a corner portion, and t 3 is a thickness of a central portion of the band part.
11. The multilayer capacitor of claim 10 , wherein the first electrode layer includes copper.
12. The multilayer capacitor of claim 10 , wherein the conductive connecting part has a melting point lower than a hardening temperature of the base resin.
13. The multilayer capacitor of claim 12 , wherein the melting point of the conductive connecting part is 300° C. or less.
14. The multilayer capacitor of claim 10 , wherein the plurality of islands have a layer form.
15. The multilayer capacitor of claim 10 , wherein the external electrode further comprises a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
16. A multilayer capacitor comprising:
a body including dielectric layers and internal electrodes; and
an external electrode disposed on one surface of the body, respectively,
wherein the external electrode includes:
a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; and
a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part,
the intermetallic compound has a form of a plurality of islands,
the body includes first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other,
the internal electrodes are alternately exposed from the third and fourth surfaces of the body,
the first electrode layers are disposed on the third and fourth surfaces of the body to be connected to exposed portions of the internal electrodes, respectively,
the external electrodes include connection parts disposed on the third and fourth surfaces of the body and band parts extended from the connection parts to portions of the first and second surfaces of the body, respectively, and
t 2 /t 1 ≥0.05 and t 3 /t 1 ≤0.5, in which t 1 is a thickness of a central portion of the connection part, t 2 is a thickness of a corner portion, and t 3 is a thickness of a central portion of the band part.
17. The multilayer capacitor of claim 16 , wherein the plurality of islands have a layer form.
18. The multilayer capacitor of claim 16 , wherein the external electrode further comprises a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.