Semiconductor devices having fin-shaped active regions

1. A semiconductor device comprising:

a substrate comprising a device region defined by a trench in the substrate;

a plurality of fm-shaped active regions spaced apart from each other in the device region and extending in a first direction; and

a plurality of protruding patterns extending along a bottom surface of the trench, one of the plurality of protruding patterns extending from a lower end of a sidewall of the device region,

wherein adjacent ones of the plurality of fin-shaped active regions are spaced apart from each other at a first pitch in a second direction perpendicular to the first direction,

wherein the plurality of protruding patterns and the plurality of fin-shaped active regions are spaced apart from each other at a second pitch in the second direction, the second pitch being greater than the first pitch,

wherein the lower end of the sidewall of the device region comprises a first lower end of a first sidewall of the device region, and

wherein the one of the plurality of protruding patterns extends from the first lower end of the first sidewall to a second lower end of a second sidewall of the device region.

2. The semiconductor device of claim 1 , wherein the plurality of fin-shaped active regions comprises a fin sidewall extending upward from the sidewall of the device region.

3. The semiconductor device of claim 1 ,

wherein the plurality of fin-shaped active regions comprise a first fm-shaped extension portion and a second fin-shaped extension portion that are spaced apart from each other and are collinear in the first direction,

wherein the first lower end of the first sidewall is under a first fin sidewall of the first fin-shaped extension portion,

wherein the second lower end of the second sidewall is under a second fin sidewall of the second fin-shaped extension portion, and

wherein the one of the plurality of protruding patterns comprises a curved protruding pattern comprising a first portion extending in a third direction different from the first direction.

4. The semiconductor device of claim 3 , wherein a second portion of the curved protruding pattern extends in the first direction and is not collinear with the first fin-shaped extension portion and the second fin-shaped extension portion, the first portion extending from the second portion to the first lower end of the first sidewall of the device region.

5. The semiconductor device of claim 4 ,

wherein the first sidewall of the device region is aligned with the first fin sidewall of the first fin-shaped extension portion, and

wherein the second sidewall of the device region is aligned with the second fin sidewall of the second fin-shaped extension portion.

6. The semiconductor device of claim 5 ,

wherein the plurality of fin-shaped active regions comprises a straight fin-shaped active region extending in the first direction in parallel with the first and second fin-shaped extension portions,

wherein the straight fin-shaped active region is spaced apart from the first and second fin-shaped extension portions at the first pitch,

wherein the plurality of protruding patterns comprises a straight protruding pattern extending in the first direction in parallel with the first and second fin-shaped extension portions, and

wherein the straight protruding pattern is spaced apart from the first and second fin-shaped extension portions at the second pitch.

7. The semiconductor device of claim 6 ,

wherein the straight fin-shaped active region is spaced apart from the second portion at the second pitch, and

wherein the straight protruding pattern is spaced apart from the second portion at the first pitch.

8. The semiconductor device of claim 4 , wherein an interval between the second portion and an axis on which the first fin-shaped extension portion and the second fin-shaped extension portion are collinear is equal to a difference between the second pitch and the first pitch.

9. The semiconductor device of claim 1 , further comprising:

an isolation layer on lower portions of fin sidewalls of the plurality of fin-shaped active regions, on the sidewall of the device region, and on the plurality of protruding patterns; and

a plurality of gate structures spaced apart from each other in the first direction and extending in the second direction on the isolation layer and on the plurality of fin-shaped active regions, each of the plurality of gate structures comprising a gate dielectric layer and a gate conductive layer.

10. The semiconductor device of claim 1 , wherein adjacent ones of the plurality of protruding patterns are spaced apart from each other at the first pitch in the second direction.

11. A semiconductor device comprising:

a substrate comprising a device region defined by a trench in the substrate;

a plurality of fin-shaped active regions spaced apart from each other in the device region and extending in a first direction; and

a plurality of protruding patterns extending along a bottom surface of the trench,

wherein an interval between the plurality of protruding patterns and the plurality of fin-shaped active regions is greater than an interval between two adjacent ones of the plurality of fin-shaped active regions, and

wherein first and second ends of one of the plurality of protruding patterns are in contact with first and second lower ends of first and second sidewalls of the device region, respectively.

12. The semiconductor device of claim 11 ,

wherein two adjacent ones of the plurality of protruding patterns are spaced apart from each other at a first pitch in a second direction perpendicular to the first direction, and

wherein the first pitch comprises the interval between the two adjacent ones of the plurality of fin-shaped active regions.

13. The semiconductor device of claim 11 , wherein a portion of the plurality of protruding patterns extends in a second direction different from the first direction.

14. The semiconductor device of claim 11 , wherein a sidewall of one of the plurality of fin-shaped active regions is on one of the first and second sidewalls of the device region.

15. A semiconductor device comprising:

a substrate comprising a device region defined by a trench in the substrate;

a plurality of fin-shaped active regions spaced apart from each other at a first pitch in the device region and extending in a first direction;

a protruding pattern extending along a bottom surface of the trench from a lower end of a sidewall of the device region;

an isolation layer on lower portions of fin sidewalls of the plurality of fin-shaped active regions, on the sidewall of the device region, and on the protruding pattern; and

a plurality of gate structures spaced apart from each other in the first direction and extending in a second direction different from the first direction on the isolation layer and on the plurality of fin-shaped active regions, wherein each of the plurality of gate structures comprises a gate dielectric film and a gate conductive layer intersecting the plurality of fin-shaped active regions,

wherein the protruding pattern and the plurality of fin-shaped active regions are spaced apart from each other at a second pitch greater than the first pitch in the second direction, and

wherein a longitudinal dimension of a first portion of the protruding pattern is in the first direction and a longitudinal dimension of a second portion of the protruding pattern is in a third direction oblique to the first direction and the second direction.

16. The semiconductor device of claim 15 , wherein one end of the protruding pattern is in contact with the lower end of the sidewall of the device region under one of the fin sidewalls of one of the plurality of fin-shaped active regions.

17. The semiconductor device of claim 16 , wherein the first portion of the protruding pattern is spaced apart in the second direction from an axis on which the one of the plurality of fin-shaped active regions extends in the first direction.

18. The semiconductor device of claim 15 , wherein one of the plurality of gate structures extends across the protruding pattern.

19. The semiconductor device of claim 15 ,

wherein the protruding pattern comprises a curved protruding pattern, and

wherein the semiconductor device further comprises a straight protruding pattern extending along the bottom surface of the trench.