Device with doped phosphorene and method for doping phosphorene
A method includes providing a black phosphorus (BP) layer over a substrate, forming a dopant source layer over the BP layer, annealing the dopant source layer to drive a dopant from the dopant source layer into the BP layer, and forming a conductive contact over the dopant source layer.
1. A method, comprising:
providing a black phosphorus (BP) layer over a substrate;
forming a dopant source layer over a source/drain region of the BP layer, wherein a channel region of the BP layer is free from coverage by the dopant source layer;
annealing the dopant source layer to drive a dopant from the dopant source layer into the BP layer; and
forming a conductive contact over the dopant source layer.
2. The method of claim 1 , wherein annealing the dopant source layer is performed such that the BP layer is metallized.
3. The method of claim 1 , wherein annealing the dopant source layer is performed such that phosphorus in the BP layer is transformed into a phosphide.
4. The method of claim 1 , further comprising forming a dielectric layer over the substrate prior to providing the BP layer.
5. The method of claim 4 , wherein the substrate comprises doped silicon.
6. The method of claim 1 , further comprising:
forming a cap metal layer over the dopant source layer prior to annealing the dopant source layer.
7. The method of claim 1 , further comprising:
forming a noble metal layer over the dopant source layer prior to forming the conductive contact.
8. The method of claim 7 , wherein forming the conductive contact is performed such that the conductive contact is formed over the noble metal layer.
9. The method of claim 1 , wherein the dopant in the dopant source layer comprises an element of Group III, an element of Group IV, or an element of Group VI.
10. The method of claim 1 , wherein forming the dopant source layer comprises forming a blanket dopant source layer over the BP layer, and patterning the blanket dopant source layer to expose the channel region of the BP layer.
11. A method, comprising:
providing a phosphorene-containing layer over a substrate;
forming a gate stack over a channel region of the phosphorene-containing layer;
converting phosphorene in a source/drain region of the phosphorene-containing layer into a compound of phosphorus and an element of Group III, IV, or VI; and
forming a source/drain contact over the source/drain region.
12. The method of claim 11 , further comprising:
replacing a dummy gate electrode of the gate stack with a metal gate electrode after converting the phosphorene into the compound.
13. The method of claim 11 , further comprising:
forming a gate spacer on a sidewall of the gate stack prior to converting the phosphorene into the compound.
14. The method of claim 11 , wherein converting the phosphorene into the compound comprises:
forming a dopant source layer over the source/drain region, the dopant source layer comprising a dopant having the element of Group III, IV or VI; and
elevating temperatures of the dopant source layer and the phosphorene-containing layer to react the dopant with the phosphorene-containing layer.
15. The method of claim 14 , wherein elevating the temperatures of the dopant source layer and the phosphorene-containing layer is performed such that the channel region of the phosphorene-containing layer is substantially free from reacting with the dopant.
16. The method of claim 11 , further comprising:
forming a two-dimensional insulator layer over the phosphorene-containing layer prior to forming the gate stack; and
removing a first portion of the two-dimensional insulator layer from the source/drain region, wherein a second portion of the two-dimensional insulator layer remains on the channel region.
17. A method, comprising:
providing a black phosphorus (BP) layer over a substrate;
metallizing source/drain regions of the BP layer, wherein a channel region of the BP layer between the source/drain regions of the BP layer remains semiconductive after metallizing the source/drain regions; and
forming source/drain contacts respectively over the metallized source/drain regions of the BP layer.
18. The method of claim 17 , wherein metallizing the source/drain regions comprises:
forming a germanium-containing layer over the source/drain regions; and
diffusing germanium from the germanium-containing layer into the source/drain regions.
19. The method of claim 18 , wherein diffusing the germanium from the germanium-containing layer into the source/drain regions is performed using an anneal process.
20. The method of claim 17 , further comprising:
forming a noble metal material over the source/drain regions prior to metallizing the source/drain regions.