IP Library › Granted Patent US 10,658,559
Granted Patent B2
US 10,658,559 · App. 16/275,014 · Granted May 19, 2020

Light emitting element and light emitting device

Inventors: Hiroki Nakai (Anan, JP); Kensuke Yamaoka (Tokushima, JP)
Assignee: NICHIA CORPORATION
H01L33/647H01L27/156H01L33/38H01L33/382H01L33/387H01L33/44H01L33/505H01L33/56H01L33/60H01L33/62H01L33/641H01L33/32H01L33/405
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Quick Facts
Patent No.
US 10,658,559
App. No.
16/275,014
Granted
May 19, 2020
Kind
B2
Abstract

A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.

Claims (45)

1. A light emitting element comprising:

a semiconductor layered body including

a first semiconductor layer,

a light emitting layer, and

a second semiconductor layer, with the light emitting layer being positioned between the first semiconductor layer and the second semiconductor layer,

the first semiconductor layer being exposed from the light emitting layer and the second semiconductor layer at a plurality of exposed parts when viewed from a second semiconductor layer side of the semiconductor layered body;

an insulating film covering the semiconductor layered body, the insulating film defining a plurality of openings respectively arranged above the plurality of exposed parts of the first semiconductor layer;

a first electrode connected to the first semiconductor layer at the exposed parts through the openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film;

a second electrode electrically connected to the second semiconductor layer;

a plurality of first external connecting parts connected to the first electrode, the first external connecting parts being spaced apart from the exposed parts in a plan view; and

at least one second external connecting part connected to the second electrode, wherein

a group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.

2. The light emitting element according to claim 1 , wherein

two or more of the first external connecting parts each have a fragmented shape corresponding to a fragment of a prescribed shape in the plan view, and

the two or more of the first external connecting parts are regularly arranged along an outline of the prescribed shape to surround a corresponding one of the exposed parts in the plan view.

3. The light emitting element according to claim 1 , wherein

one of the first external connecting parts adjacent to an outer edge of the semiconductor layered body has a larger surface area than a surface area of one of the first external connecting parts not adjacent to the outer edge of the semiconductor layered body in the plan view.

4. The light emitting element according to claim 1 , wherein

the exposed parts are arranged in a matrix including a plurality of columns extending in a first direction parallel to an outer edge of a part of the semiconductor layered body and a plurality of rows extending in a second direction perpendicular to the first direction.

5. The light emitting element according to claim 4 , wherein

in the plan view, the at least one second external connecting part has a shape elongated in the first direction, and the at least one second external connecting part is interposed between the first external connecting parts in the second direction.

6. The light emitting element according to claim 4 , further comprising

at least one additional second external connecting part, wherein

the at least one second external connecting part and the at least one additional second external connecting part are aligned along the first direction and interposed between the first external connecting parts in the plan view.

7. The light emitting element according to claim 1 , wherein

in the plan view, none of the first external connecting parts is disposed between the second electrode and one of the exposed parts adjacent to the second electrode.

8. A light emitting device comprising:

a substrate including a wiring pattern on an upper surface;

the light emitting element according to claim 1 , the light emitting element being flip-chip mounted on the wiring pattern via the first external connecting parts and the at least one second external connecting part; and

a covering member covering the substrate and the light emitting element including the first external connecting parts and the at least one second external connecting part.

9. The light emitting element according to claim 8 , wherein the first external connecting parts each have a fragmented shape, and the exposed parts are each regularly surrounded by the fragments.

10. The light emitting device according to claim 8 , wherein

the covering member contains a light-reflective substance.

11. The light emitting element according to claim 8 , wherein

the light emitting element further includes at least one additional second external connecting part, the at least one second external connecting part and the at least one additional second external connecting part each having a fragmented shape, and being spaced apart from each other in the plan view.

12. The light emitting device according to claim 8 , wherein the covering member includes resin.

13. The light emitting device according to claim 8 , wherein the substrate is one of alumina and aluminum nitride.

14. The light emitting device according to claim 8 , further comprising a light-transmissive member at an upper surface of the light emitting element.

15. The light emitting device according to claim 13 , wherein the light-transmissive member contains a fluorescent material.

16. The light emitting element according to claim 2 , wherein

the prescribed shape is a circular ring shape surrounding the corresponding one of the exposed parts.

17. The light emitting element according to claim 2 , wherein

all of the first external connecting parts have the fragmented shape.

18. The light emitting element according to claim 2 , wherein

at least one of the first external connecting parts has a shape different from the fragmented shape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2019
From: NAKAI, HIROKI; YAMAOKA, KENSUKE
To: NICHIA CORPORATION
Reel/Frame 048322/0987 →
Priority Claims (2)
JP 2018-035365 · Feb 28, 2018 · national
JP 2018-224687 · Nov 30, 2018 · national
Continuity (1)
Related Publication 20190267529A1 · Aug 29, 2019