IP Library › Granted Patent US 10,658,831
Granted Patent B2
US 10,658,831 · App. 15/672,958 · Granted May 19, 2020

Overcurrent protection circuit

Inventors: Toru Takuma (Kyoto, JP); Shuntaro Takahashi (Kyoto, JP); Naoki Takahashi (Kyoto, JP)
Assignee: Rohm Co., Ltd.
H02H3/08B60R16/02G05F1/573G06F1/305H02H9/02H02H9/025H03K19/00315H02H3/085H02H5/04H03K2017/0806
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,658,831
App. No.
15/672,958
Granted
May 19, 2020
Kind
B2
Abstract

An overcurrent protection circuit includes a current control part configured to control conductance of a transistor so as to limit an output current flowing when the transistor is turned on to a predetermined upper limit or less, and a duty control part configured to forcibly turning on/off the transistor at a predetermined duty ratio when a temperature protection circuit detects a temperature abnormality in a state where the current control part limits the output current.

Claims (48)

1. A semiconductor integrated circuit device comprising:

a transistor configured to conduct/interrupt a current path through which an output current flows;

a gate control part configured to generate a driving signal of the transistor in response to a control signal;

a temperature protection circuit configured to detect a temperature abnormality of the device; and

an overcurrent protection circuit including:

a current control part configured to control conductance of the transistor so as to limit the output current flowing when the transistor is turned on to a predetermined upper limit or less; and

a duty control part configured to forcibly turn on/off the transistor at a predetermined duty ratio when the temperature protection circuit detects the temperature abnormality in a state where the current control part limits the output current,

wherein the temperature protection circuit is configured to monitor a temperature of the transistor and detect the temperature abnormality, and

wherein a first temperature detecting element for detecting the temperature of the transistor is disposed near a pad of the transistor within a formation region of the transistor.

2. The semiconductor integrated circuit device of claim 1 , wherein the current control part is configured to compare a sense voltage corresponding to the output current with a threshold voltage corresponding to the upper limit and generate a first overcurrent protection signal for controlling the conductance of the transistor and a status notification signal for notifying the duty control part of the state where the current control part limits the output current.

3. The semiconductor integrated circuit device of claim 2 , wherein the duty control part includes:

a latch configured to switch and hold a pulse generation control signal from a logic level at the time of disabling to a logic level at the time of enabling when the state notification signal is at a logic level at the time of current limitation and a temperature protection signal is at a logic level at the time of abnormality detection;

a pulse signal generation part configured to generate a pulse signal having the duty ratio while the pulse generation control signal is at the logic level at the time of enabling; and

a level shifter configured to generate a second overcurrent protection signal for forcibly turning on/off the transistor at the duty ratio by level-shifting the pulse signal.

4. The semiconductor integrated circuit device of claim 3 , wherein the pulse signal generation part is configured to continue generating the pulse signal until the pulse generation control signal is reset to the logic level at the time of disabling.

5. The semiconductor integrated circuit device of claim 1 , wherein the temperature protection circuit is formed adjacent to the transistor and the first temperature detecting element is disposed near a corner closest to the temperature protection circuit among four corners of the pad.

6. The semiconductor integrated circuit device of claim 1 , wherein the temperature protection circuit is configured to monitor a temperature difference between the temperature of the transistor and a temperature of another integrated circuit and detect the temperature abnormality.

7. The semiconductor integrated circuit device of claim 6 , wherein the temperature protection circuit is formed adjacent to the transistor, and a second temperature detecting element for detecting the temperature of the another integrated circuit is disposed in a formation region of the temperature protection circuit.

8. An electronic apparatus comprising:

the semiconductor integrated circuit device of claim 1 ; and

a load connected to the semiconductor integrated circuit device.

9. The electronic apparatus of claim 8 , wherein the load is a bulb lamp, a relay coil, a solenoid, a light emitting diode or a motor.

10. A vehicle comprising the electronic apparatus of claim 8 .

11. A semiconductor integrated circuit device comprising:

a transistor configured to conduct/interrupt a current path through which an output current flows;

a gate control part configured to generate a driving signal of the transistor in response to a control signal;

a temperature protection circuit configured to detect a temperature abnormality of the device; and

an overcurrent protection circuit including:

a current control part configured to control conductance of the transistor so as to limit the output current flowing when the transistor is turned on to a predetermined upper limit or less; and

a duty control part configured to forcibly turn on/off the transistor at a predetermined duty ratio when the temperature protection circuit detects the temperature abnormality in a state where the current control part limits the output current,

wherein the temperature protection circuit is configured to monitor a temperature difference between a temperature of the transistor and a temperature of another integrated circuit and detect the temperature abnormality.

12. The semiconductor integrated circuit device of claim 11 , wherein the duty control part includes a pulse signal generation part configured to continue generating a pulse signal until a pulse generation control signal is reset to a logic level at the time of disabling.

13. The semiconductor integrated circuit device of claim 11 , wherein the temperature protection circuit is configured to monitor the temperature of the transistor and detect the temperature abnormality.

14. An overcurrent protection circuit comprising:

a current control part configured to control conductance of a transistor so as to limit an output current flowing when the transistor is turned on to a predetermined upper limit or less; and

a duty control part configured to forcibly turn on/off the transistor at a predetermined duty ratio when a temperature protection circuit detects a temperature abnormality in a state where the current control part limits the output current,

wherein the current control part is configured to compare a sense voltage corresponding to the output current with a threshold voltage corresponding to the upper limit and generate a first overcurrent protection signal for controlling the conductance of the transistor and a status notification signal for notifying the duty control part of the state where the current control part limits the output current, and

wherein the duty control part includes:

a latch configured to switch and hold a pulse generation control signal from a logic level at the time of disabling to a logic level at the time of enabling when the state notification signal is at a logic level at the time of current limitation and a temperature protection signal is at a logic level at the time of abnormality detection;

a pulse signal generation part configured to generate a pulse signal having the duty ratio while the pulse generation control signal is at the logic level at the time of enabling; and

a level shifter configured to generate a second overcurrent protection signal for forcibly turning on/off the transistor at the duty ratio by level-shifting the pulse signal.

15. The overcurrent protection circuit of claim 14 , wherein the pulse signal generation part is configured to continue generating the pulse signal until the pulse generation control signal is reset to the logic level at the time of disabling.

16. A semiconductor integrated circuit device comprising:

the overcurrent protection circuit of claim 14 ;

the transistor configured to conduct/interrupt a current path through which the output current flows;

a gate control part configured to generate a driving signal of the transistor in response to a control signal; and

the temperature protection circuit configured to detect the temperature abnormality of the device.

17. The semiconductor integrated circuit device of claim 16 , wherein the temperature protection circuit is configured to monitor a temperature of the transistor and detect the temperature abnormality.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2017
From: TAKUMA, TORU; TAKAHASHI, SHUNTARO; TAKAHASHI, NAOKI
To: ROHM CO., LTD.
Reel/Frame 043248/0940 →
Priority Claims (1)
JP 2016-157832 · Aug 10, 2016 · national
Continuity (1)
Related Publication 20180048140A1 · Feb 15, 2018