Camera module and molded circuit board assembly and manufacturing method thereof

1. A molded circuit board assembly for a camera module, comprising:

at least one circuit board, and

at least one molded base integrally formed with said circuit board through a molding process, wherein said molded base has at least one light window which provides a light path for a photosensitive element of the camera module, wherein said molded base has an inner side surface which is integrally extended from said circuit board, and at least one portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said molded base is formed by resin material which is solidified from a viscous fluid on said circuit board, such that said molded base is integrally molded with said circuit board, wherein said molded base has a top end and a top groove is formed in said top end of said molded base, wherein said inner side surface of said molded base is a stepped surface having a first portion inner side surface, a second portion inner side surface and a third portion inner side surface which are successively and integrally extended, wherein said first portion inner side surface is integrally and inclinedly extended from said circuit board, and said third portion inner side surface is integrally and inclinedly extended from said second portion inner side surface, wherein said second portion inner side surface and said third portion inner side surface define said top groove, wherein said first portion inner side surface of said molded base and an optical axis line direction of said camera module define an inclination angle α for facilitating demoulding and avoid stray light, wherein an angle range of said inclination angle α is 3° to 15°, wherein said third portion inner side surface of said molded base and said optical axis line direction of said camera module define an inclination angle β for facilitating demoulding and avoid stray light, wherein an angle range of said inclination angle β is 3° to 15°, wherein said molded base has an outer side surface which is flatly extended from said circuit board, wherein said outer side surface of said molded base has a plurality of outer peripheral surfaces arranged along an outer peripheral direction of said molded base, wherein at least one of said outer peripheral surfaces of said outer side surface of said molded base and said optical axis line direction of said camera module define an inclination angle γ having an angle range 3° to 15°.

2. The molded circuit board assembly, as recited in claim 1 , wherein said circuit board comprises a base board, wherein at an outer side of at least one of said outer peripheral surfaces of said outer side surface of said molded base, said base board of said circuit board has a press-fit distance W which is convenient to press-fit for at least one diving block of a molding mould in said molding process, wherein a numerical value range of said press-fit distance W is 0.1 mm to 0.6 mm.

3. A camera module, comprising:

at least one lens,

at least one photosensitive element, and

at least one molded circuit board assembly, which comprises at least one circuit board and at least one molded base integrally formed with said circuit board through a molding process, wherein said molded base has at least one light window which provides a light path for said photosensitive element, wherein said molded base has an inner side surface integrally extended from said circuit board, and at least one portion of said inner side surface is inclinedly extended for facilitating demoulding in said molding process, wherein said molded base is formed by resin material which is solidified from a viscous fluid on said circuit board, such that said molded base is integrally molded with said circuit board, wherein said molded base has a top end and a top groove formed in said top end of said molded base, wherein said inner side surface of said molded base is a stepped surface having a first portion inner side surface, a second portion inner side surface and a third portion inner side surface which are successively and integrally extended, wherein said first portion inner side surface is integrally and inclinedly extended from said circuit board, and said third portion inner side surface is integrally and inclinedly extended from said second portion inner side surface, wherein said second portion inner side surface and said third portion inner side surface define said top groove, wherein said first portion inner side surface of said molded base and an optical axis line direction of said camera module define an inclination angle α for facilitating demoulding and avoid stray light, wherein an angle range of said inclination angle α is 3° to 15°, wherein said third portion inner side surface of said molded base and said optical axis line direction of said camera module define an inclination angle β having an angle range of 3° to 15°, wherein said molded base has an outer side surface which is a flat surface inclined extended from said circuit board, wherein said outer side surface of said molded base has a plurality of outer peripheral surfaces arranged along an outer peripheral direction of said molded base, wherein at least one of said outer peripheral surfaces of said outer side surface of said molded base and said optical axis line direction of said camera module define an inclination angle γ having an angle range of 3° to 15°.

4. The camera module, as recited in claim 3 , wherein said circuit board comprises a base board, wherein at an outer side of at least one of said outer peripheral surfaces of said outer side surface of said molded base, said base board of said circuit board has a press-fit distance W which is convenient to press-fit for at least one diving block of a molding mould in said molding process, wherein a numerical value range of said press-fit distance W is 0.1 mm to 0.6 mm.