IP Library › Granted Patent US 10,662,055
Granted Patent B2
US 10,662,055 · App. 15/961,564 · Granted May 26, 2020

MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle

Inventors: Takashi Yamazaki (Shiojiri, JP); Akihiko Ebina (Fujimi-machi, JP); Osamu Kawauchi (Shiojiri, JP); Yoshihiko Yokoyama (Chino, JP)
Assignee: SEIKO EPSON CORPORATION
B81B7/007B81C1/00301B81B2207/096
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Quick Facts
Patent No.
US 10,662,055
App. No.
15/961,564
Granted
May 26, 2020
Kind
B2
Abstract

A MEMS element includes a surface silicon layer on which an element is formed and on which a first electrode and a second electrode as element electrodes and an electrode pad connected to the first electrode and the second electrode are disposed, and in which a first wiring through-hole is disposed at a position overlapping with the electrode pad of the surface silicon layer and a wiring electrode electrically connected to the electrode pad is disposed in the first wiring through-hole, in plan view.

Claims (14)

1. A Micro Electro Mechanical System (MEMS) element comprising:

an element substrate on which an element is formed and an element electrode and an electrode pad connected to the element electrode are disposed;

a support substrate supporting the element substrate; and

a lid which is connected to the element substrate and forms an internal space with the element substrate and the support substrate, wherein:

a first wiring through-hole is disposed at a position overlapping with the electrode pad of the element substrate in plan view,

a second wiring through-hole communicating with the first wiring through-hole is disposed in the support substrate,

a wiring electrode electrically connected to electrode pad is disposed in the first wiring through-hole,

a first sealing hole that seals the internal space is disposed in the element substrate, and

a second sealing hole communicating with the first sealing hole is provided in the support substrate.

2. The MEMS element according to claim 1 , wherein

an element adjustment layer is disposed between the element and the element electrode, and

the element adjustment layer is also disposed between the electrode pad and the element substrate.

3. The MEMS element according to claim 1 , wherein a metal layer comprised of the same material as the wiring electrode seals the first sealing hole.

4. The MEMS element according to claim 1 , wherein the wiring electrode is a sputtered layer and has a plating layer stacked on the sputtered layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2018
From: YAMAZAKI, TAKASHI; EBINA, AKIHIKO; KAWAUCHI, OSAMU; YOKOYAMA, YOSHIHIKO
To: SEIKO EPSON CORPORATION
Reel/Frame 045626/0251 →
Priority Claims (6)
JP 2017-087982 · Apr 27, 2017 · national
JP 2017-087986 · Apr 27, 2017 · national
JP 2017-097934 · May 17, 2017 · national
JP 2017-106272 · May 30, 2017 · national
JP 2017-146224 · Jul 28, 2017 · national
JP 2017-146226 · Jul 28, 2017 · national
Continuity (1)
Related Publication 20180312395A1 · Nov 1, 2018