IP Library Granted Patent US 10,663,231
Granted Patent B2
US 10,663,231 · App. 15/615,140 · Granted May 26, 2020

Manufacturing method of heat conducting device

Inventors: Li-Kuang Tan (Taoyuan, TW); Shih-Kang Lin (Taoyuan, TW)
Assignee: DELTA ELECTRONICS, INC.
F28D15/0275B23P15/26F28D15/0233F28D15/0266F28D15/046H01L21/4882H01L23/3736H01L23/427H01L23/3672Y10T29/49353Y10T29/49359
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Quick Facts
Patent No.
US 10,663,231
App. No.
15/615,140
Granted
May 26, 2020
Kind
B2
Abstract

A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.

Claims (31)

1. A manufacturing method of a heat conducting device, comprising steps of:

providing a first plate, wherein the first plate comprises a plate body and at least a heat conducting element, the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube;

providing a second plate, wherein the second plate has a first opening end;

providing a mold, wherein a shape of the mold corresponds to a shape of the first plate;

disposing a first wick structure on a surface of the mold;

inserting the mold with the first wick structure to the heat conducting element of the first plate;

disposing the first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body through the mold; and

removing the mold;

disposing a second wick structure on an internal wall of the second plate; and

connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber.

2. The manufacturing method of claim 1 , wherein the heat conducting element is a heat pipe or a temperature plate.

3. The manufacturing method of claim 1 , wherein the first plate is integrally formed as one piece.

4. The manufacturing method of claim 1 , wherein the heat conducting element has a second opening end, and the manufacturing method further comprises a step of:

inserting the second opening end of the heat conducting element into an inner side of the tube.

5. The manufacturing method of claim 1 , wherein the heat conducting element has a second opening end, and the manufacturing method further comprises a step of:

inserting the second opening end of the heat conducting element on an outer side of the tube.

6. The manufacturing method of claim 1 , wherein a size of an inner side of the first opening end is substantially the same as a size of the plate body.

7. The manufacturing method of claim 1 , wherein thicknesses of the plate body and the first wick structure are substantially the same as a distance between the first opening end and the second wick structure.

8. The manufacturing method of claim 1 , wherein the first wick structure is connected to the second wick structure.

9. The manufacturing method of claim 1 , wherein before the step of connecting the first plate and the second plate to form the chamber, the manufacturing method further comprises steps of:

providing at least a supporting member; and

disposing the supporting member between the second wick structure of the second plate and the first wick structure of the plate body.

10. The manufacturing method of claim 9 , wherein the supporting member has a structure the same as the first wick structure or the second wick structure.

11. The manufacturing method of claim 1 , wherein the heat conducting element is connected to the plate body by sintering or welding.

12. The manufacturing method of claim 1 , wherein the first plate and the second plate are connected by sintering or welding.

13. The manufacturing method of claim 1 , further comprising steps of:

providing a plurality of fins; and

assembling the fins to the heat conducting element.

14. The manufacturing method of claim 1 , further comprising steps of:

vacuuming the chamber; and

filling a working fluid in the chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2017
From: TAN, LI-KUANG; LIN, SHIH-KANG
To: DELTA ELECTRONICS, INC.
Reel/Frame 042645/0701 →
Priority Claims (1)
CN 2017 1 0377130 · May 25, 2017 · national
Continuity (2)
Provisional Application 62347459 · Jun 8, 2016
Related Publication 20170356694A1 · Dec 14, 2017
Cited By (3)
US 12,274,030 US 12,366,419 US 12,727,120