IP Library Granted Patent US 10,668,696
Granted Patent B2
US 10,668,696 · App. 15/388,070 · Granted Jun 2, 2020

Bonding structure on gold thin film

Inventors: Shohei Kumeta (Tokyo, JP); Gento Yoshino (Sakura, JP); Yohei Kasai (Sakura, JP); Akira Sakamoto (Sakura, JP)
Assignee: FUJIKURA LTD.
B32B15/04B32B7/12B32B15/20B32B17/00B32B37/12B32B38/0008C03C27/048C09J5/02C09J201/00H01L24/83B32B2250/02B32B2250/44B32B2255/06B32B2255/205B32B2255/28B32B2307/412B32B2307/50B32B2307/538B32B2307/732B32B2457/00B32B2551/00C09J2205/31C09J2400/163C09J2400/166H01L24/29H01L24/32H01L2224/2919H01L2224/32245H01L2224/83014H01L2224/8385H01L2224/83395H01L2224/83444H01L2224/83455H01L2224/83874H01L2924/12042H01L2924/15747Y10T428/24917
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Quick Facts
Patent No.
US 10,668,696
App. No.
15/388,070
Granted
Jun 2, 2020
Kind
B2
Abstract

The present invention provides a bonding method (S 1 ) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member ( 14 ), even in a case where the first member ( 11 ) has a surface on which a gold thin film ( 12 ) is formed. The first member ( 11 ) is made of a material other than gold and has a surface on which the gold thin film ( 12 ) is formed. The bonding method (S 1 ) includes the steps of: (S 11 ) irradiating, with laser light, at least part of a specific region ( 12 a ) of the surface of the first member ( 11 ), so that a base of the thin film ( 12 ) is exposed in the at least part of the specific region ( 12 a ); and (S 12 ) bonding the second member ( 14 ) to the specific region ( 12 a ) by use of an adhesive ( 13 ).

Claims (22)

1. A structure comprising:

a first member; and

a second member,

the first member being made of a material other than gold and having a surface on which a gold thin film is formed,

the second member being made of a material other than gold,

the first member containing a specific region, the surface of the first member being exposed by removing the gold thin film via laser irradiation with laser light in at least a part of the specific region,

the second member being bonded to the specific region by use of an adhesive,

wherein:

the specific region is contained in a region to which the second member is bonded on the surface of the first member and the specific region has an outer circumference having no angular corner; and

a sum total of an area of a region in which the gold thin film remains in the specific region is greater than 0% but not more than 60% of an area of the specific region.

2. The structure as set forth in claim 1 , wherein the specific region is an annular region which extends along an outer circumference of a region to which the second member is bonded on the surface of the first member.

3. The structure as set forth in any one of claim 1 , wherein the second member is a transparent member.

4. A structure comprising:

a first member; and

a second member,

the first member being made of a material other than gold and having a surface on which a gold thin film is formed,

the second member being made of a material other than gold,

the first member containing a specific region, the surface of the first member being exposed by removing the gold thin film via laser irradiation with laser light in at least a part of the specific region,

the second member being bonded to the specific region by use of an adhesive,

wherein the specific region is an annular region which extends along an outer circumference of a region to which the second member is bonded on the surface of the first member, and

a sum total of an area of a region in which the gold thin film remains in the specific region is greater than 0% but not more than 60% of an area of the specific region.

5. The structure as set forth in claim 4 , wherein the second member is a transparent member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2016
From: KUMETA, SHOHEI; YOSHINO, GENTO; KASAI, YOHEI; SAKAMOTO, AKIRA
To: FUJIKURA LTD.
Reel/Frame 040749/0195 →
Priority Claims (1)
JP 2014-136226 · Jul 1, 2014 · national
Continuity (2)
Continuation PCTJP2015056140 · Mar 3, 2015
Related Publication 20170100917A1 · Apr 13, 2017