IP Library › Granted Patent US 10,669,456
Granted Patent B2
US 10,669,456 · App. 16/052,617 · Granted Jun 2, 2020

Adhesive resin composition and laminate

Inventors: Hirokazu Iizuka (Tokyo, JP); Kunihiro Takei (Tokyo, JP); Jun Suzuki (Tokyo, JP)
Assignee: FUJIMORI KOGYO CO., LTD.
C09J123/26C09J151/06C08L2205/03
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Quick Facts
Patent No.
US 10,669,456
App. No.
16/052,617
Granted
Jun 2, 2020
Kind
B2
Abstract

Provided are an adhesive resin composition that can be uniformly applied, has high adhesiveness, and further has high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component having a melting point of higher than 80° C. and 140° C. or lower, a crosslinking agent component, and a solvent component, in which the solvent component contains an aromatic solvent, an aliphatic solvent, and a ketone-based solvent, the aromatic solvent has a highest boiling point, and the solvent component contains the aromatic solvent in an amount of 50 parts by mass or more and 80 parts by mass or less, the aliphatic solvent in an amount of 10 parts by mass or more and 30 parts by mass or less, and the ketone-based solvent in an amount of 5 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of a total amount of the solvent component.

Claims (24)

1. An adhesive resin composition comprising:

an acid-modified polyolefin resin component (A) having a melting point of higher than 80° C. and 140° C. or lower;

a crosslinking agent component (B); and

a solvent component (S),

wherein

said solvent component (S) contains an aromatic solvent (S 1 ), an aliphatic solvent (S 2 ), and a ketone-based solvent (S 3 ),

said aromatic solvent (S 1 ) is toluene,

said aliphatic solvent (S 2 ) is methylcyclohexane,

said ketone-based solvent (S 3 ) is methyl ethyl ketone,

said aromatic solvent (S 1 ) has a highest boiling point, and

said solvent component (S) contains said aromatic solvent (S 1 ) in an amount of 50 parts by mass or more and 80 parts by mass or less, said aliphatic solvent (S 2 ) in an amount of 10 parts by mass or more and 30 parts by mass or less, and said ketone-based solvent (S 3 ) in an amount of 5 parts by mass or more and 20 parts by mass or less, based on 100 parts by mass of a total amount of said solvent component (S).

2. The adhesive resin composition according to claim 1 , further comprising a resin component (C) having an amino group at a molecular end.

3. The adhesive resin composition according to claim 1 , wherein said adhesive resin composition has a solid content concentration of 5% by mass or more and 20% by mass or less.

4. The adhesive resin composition according to claim 1 , wherein said acid-modified polyolefin resin component (A) has an acid addition amount of 0.5% by mass or more and 3.0% by mass or less.

5. The adhesive resin composition according to claim 1 , wherein said crosslinking agent component (B) is a resin component (B 1 ) having an epoxy group in a molecule.

6. The adhesive resin composition according to claim 2 , wherein said resin component (C) is at least one selected from the group consisting of an olefin resin in which a molecular end is modified with an amino group, a polyamine resin, a polyamide resin in which a molecular end is modified with an amino group, a melamine resin, and a urea resin.

7. The adhesive resin composition according to claim 2 , wherein said resin component (C) has a weight average molecular weight of 2,000 or more.

8. The adhesive resin composition according to claim 1 , wherein said crosslinking agent component (B) is a novolac-modified epoxy resin.

9. The adhesive resin composition according to claim 1 , wherein said crosslinking agent component (B) contains a compound having a bisphenol A structure in a molecule.

10. The adhesive resin composition according to claim 1 , further comprising an isocyanate compound (D).

11. A laminate comprising:

an adherend; and

an adhesive resin layer laminated on one side of said adherend,

wherein said adhesive resin layer is formed of the adhesive resin composition according to claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Jan 30, 2025
From: FUJIMORI KOGYO CO., LTD.
To: ZACROS CORPORATION
Reel/Frame 070060/0612 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2018
From: IIZUKA, HIROKAZU; TAKEI, KUNIHIRO; SUZUKI, JUN
To: FUJIMORI KOGYO CO., LTD.
Reel/Frame 046688/0543 →
Priority Claims (1)
JP 2017-160387 · Aug 23, 2017 · national
Continuity (1)
Related Publication 20190062605A1 · Feb 28, 2019
Cited By (1)
US 1,119,918