IP Library › Granted Patent US 10,670,309
Granted Patent B2
US 10,670,309 · App. 14/980,025 · Granted Jun 2, 2020

Thermo-magnetic cooling system and electronic apparatus

Inventor: Xiao He (Beijing, CN)
Assignee: LENOVO (BEIJING) CO., LTD.
F25B21/00Y02B30/66
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,670,309
App. No.
14/980,025
Granted
Jun 2, 2020
Kind
B2
Abstract

A thermo-magnetic cooling system and an electronic apparatus including the thermo-magnetic cooling system are described. The thermo-magnetic cooling system includes a heat source and a liquid cooling device. Heat emitted from the heat source is transferred to the liquid cooling device and fluid circulates in the liquid cooling device to dissipate heat. The fluid is a magnetic fluid that can be magnetized and demagnetized. A part of the liquid cooling device is provided with an external magnetic field so as to magnetize the magnetic fluid.

Claims (12)

1. A thermo-magnetic cooling system comprising:

a heat source; and

a liquid cooling device,

wherein heat emitted from the heat source is transferred to the liquid cooling device, fluid circulates in the liquid cooling device to dissipate heat,

wherein the fluid is a magnetic fluid configured to be magnetized and demagnetized, and a part of the liquid cooling device is provided with an external magnetic field for magnetizing the magnetic fluid,

wherein the magnetic fluid comprises a liquid comprising the following materials dispersed therein: Fe 3 O 4 nanoparticles, ferromagnetic rare earth metal nanoparticles, GdSiGeZn alloy nanoparticles, and rare earth containing chemical compounds magnetic nanoparticles; and

wherein the external magnetic field is disposed at an upper portion of the liquid cooling device, and a main heat dissipating portion of the liquid cooling device comprises a cooling fin, and the external magnetic field is disposed outside the cooling fin.

2. The thereto-magnetic cooling system according to claim 1 , wherein the heat source and the liquid cooling device are provided with an interface material layer there between, and the interface material layer is used to reduce the thermal resistance between the heat source and the liquid cooling device.

3. The thereto-magnetic cooling system according to claim 1 , wherein the liquid cooling device is includes a pump to circulate the fluid in the liquid cooling device.

4. The thermo-magnetic cooling system according to claim 1 , wherein the heat source comprises an electronic device.

5. The thermo-magnetic-cooling system according to claim 4 , wherein the electronic device comprises a semiconductor element.

6. The thereto-magnetic cooling system according to claim 4 , wherein the electronic device comprises a transistor element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2015
From: HE, XIAO
To: LENOVO (BEIJING) CO., LTD.
Reel/Frame 037367/0824 →
Priority Claims (1)
CN 2015 1 0583460 · Sep 14, 2015 · national
Continuity (1)
Related Publication 20170074554A1 · Mar 16, 2017