IP Library › Granted Patent US 10,670,972
Granted Patent B2
US 10,670,972 · App. 14/304,665 · Granted Jun 2, 2020

Method and apparatus for exposing a structure on a substrate

Inventors: Rudolf Zelsacher (Klagenfurt, AT); Peter Irsigler (Obernberg am Inn, AT)
Assignee: Infineon Technologies AG
G03F7/70425G03F7/70283G03F7/70291G03F7/70325
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Quick Facts
Patent No.
US 10,670,972
App. No.
14/304,665
Granted
Jun 2, 2020
Kind
B2
Abstract

A method for exposing a structure on a substrate includes positioning of an invariable reticle and a programmable reticle in a light path between a light source and a layer on a substrate to be exposed to light and exposing the layer on the substrate by light from the light source passing the invariable reticle and the programmable reticle.

Claims (24)

1. A method for exposing a structure on a substrate, the method comprising:

positioning an invariable reticle and a programmable reticle in a single light path between a first light source and a layer on the substrate, the layer to be exposed to light; and

exposing the layer on the substrate by light from the first light source passing through both the invariable reticle and the programmable reticle.

2. The method of claim 1 , wherein the programmable reticle comprises an array of pixels with controllable transparency.

3. The method of claim 2 , wherein each pixel of the array of pixels comprises a state that is either a transparent state or an opaque state during exposure of the layer on the substrate.

4. The method of claim 1 , wherein the programmable reticle comprises an array of liquid crystal cells or an array of micro mirror cells.

5. The method of claim 1 , wherein a minimal structure size of structures exposed on the layer on the substrate resulting from structures on the invariable reticle is smaller than a minimal structure size of structures exposed on the layer on the substrate resulting from structures on the programmable reticle.

6. The method of claim 1 , wherein a minimal structure size of structures exposed on the layer on the substrate resulting from structures on the programmable reticle is smaller than 5 μm.

7. The method of claim 1 , further comprising scaling down structures on the invariable reticle and the programmable reticle using an optical unit to reproduce scaled down structures on the layer on the substrate.

8. The method of claim 1 , further comprising moving the substrate relative to the programmable reticle.

9. The method of claim 8 , further comprising exposing a second structure on the layer on the substrate by light from the first light source passing the invariable reticle and the programmable reticle after the moving.

10. The method of claim 1 , further comprising reprogramming the programmable reticle to obtain different structures on the same or different layers on the substrate before and after the reprogramming of the programmable reticle.

11. The method of claim 1 , wherein the programmable reticle is programmed to enable exposure of first structures during exposure of a first part of the layer on the substrate and is programmed to enable exposure of second structures during exposure of a second part of the layer on the substrate, wherein the first structures are different from the second structures.

12. The method of claim 1 , wherein the programmable reticle is programmed to enable exposure of first structures during exposure of at least a part of a first layer on the substrate and is programmed to enable exposure of second structures during exposure of at least a part of a second layer on the substrate, wherein the first structures are different from the second structures.

13. The method of claim 1 , wherein the programmable reticle is used to control an exposure of a lot-wafer-chip code structure, a repair structure or a fuse programming structure.

14. An apparatus for exposing a structure on a substrate, the apparatus comprising:

a first light source;

a first reticle carrier configured to carry an invariable reticle;

a second reticle carrier configured to carry a programmable reticle; and

a substrate carrier configured to carry a substrate,

wherein the first light source, the first reticle carrier, the second reticle carrier and the substrate carrier are arranged to enable exposing a layer on the substrate carried by the substrate carrier by light from the first light source passing through both the invariable reticle carried by the first reticle carrier and the programmable reticle carried by the second reticle carrier.

15. The apparatus of claim 14 , further comprising a reticle control module configured to provide a control signal to control a programming of the programmable reticle carried by the second reticle carrier.

16. The apparatus of claim 15 , wherein the programmable reticle comprises an array of liquid crystal cells or an array of micro mirror cells.

17. The apparatus of claim 14 , further comprising an optical unit configured to scale down structures on the invariable reticle and the programmable reticle to reproduce scaled down structures on the layer on the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2014
From: ZELSACHER, RUDOLF; IRSIGLER, PETER
To: INFINEON TECHNOLOGIES AG
Reel/Frame 033115/0975 →
Continuity (1)
Related Publication 20150362841A1 · Dec 17, 2015