Semiconductor power device including ring frame for thermal impedance reduction
A semiconductor power device including a base plate, a ring frame disposed over the base plate, a semiconductor power die disposed on the base plate and surrounded by the ring frame, an input lead by way the semiconductor power die receives an input signal, wherein the input lead is disposed over a first portion of the ring frame, and an output lead by way an output signal generated by the semiconductor power die is sent to another device, wherein the output lead is disposed over a second portion of the ring frame. The ring frame may be comprised of a relatively high thermal conductivity material, such as beryllium-oxide (Be), silicon-carbide (SiC), diamond, aluminum nitride (AlN), or others. The ring frame produces at least one more heat path between the active region of the semiconductor power die and the base plate so as to reduce the effective thermal impedance.
1. A semiconductor power device, comprising:
a base plate;
a ring frame disposed on the base plate;
an input lead disposed on the ring frame;
an output lead disposed on the ring frame;
a semiconductor power die disposed on the base plate and surrounded by the ring frame, wherein the semiconductor power die is configured to receive an input signal from the input lead and generate an output signal at the output lead; and
a thermal substrate disposed on the base plate, wherein the thermal substrate is thermally and electrically coupled to a set of one or more electrodes on the semiconductor power die to reduce a temperature of an active region of the semiconductor power die, wherein the thermal substrate comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).
2. The semiconductor power device of claim 1 , wherein the ring frame comprises an electrically-insulating material.
3. The semiconductor power device of claim 1 , wherein the ring frame comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).
4. The semiconductor power device of claim 1 , wherein the semiconductor power die comprises a field effect transistor (FET).
5. The semiconductor power device of claim 4 , further comprising:
a first set of one or more electrical conductors electrically coupling the input lead to one or more gate electrodes of the FET;
a second set of one or more electrical conductors electrically coupling one or more source electrodes of the FET to the base plate; and
a third set of one or more electrical conductors electrically coupling one or more drain electrodes of the FET to the output lead.
6. The semiconductor power device of claim 5 , wherein at least one of the first, second, or third set of one or more electrical conductors comprise at least one wirebond or conductive-ribbon.
7. The semiconductor power device of claim 1 , wherein the semiconductor power die comprises:
a silicon carbide (SiC) substrate disposed on the base plate; and
a gallium nitride (GaN) layer disposed on the SiC substrate.
8. The semiconductor power device of claim 1 , wherein the thermal substrate comprises a top metallization layer, and further comprising a first set of one of more electrical conductors electrically coupling the set of one or more electrodes to the top metallization layer of the thermal substrate.
9. The semiconductor power device of claim 1 , further comprising a metal bar disposed on the base plate, wherein the metal bar is thermally and electrically coupled to another set of one or more electrodes on the semiconductor power die to reduce the temperature of the active region of the semiconductor power die.
10. The semiconductor power device of claim 9 , wherein the semiconductor power die comprises a field effect transistor (FET), and wherein the another set of one or more electrodes comprises a set of one or more source electrodes of the FET, respectively.
11. A semiconductor power device, comprising:
a base plate;
a ring frame disposed on the base plate;
an input lead disposed on the ring frame;
an output lead disposed on the ring frame;
a semiconductor power die disposed on the base plate and surrounded by the ring frame, wherein the semiconductor power die is configured to receive an input signal from the input lead and generate an output signal at the output lead;
a thermal substrate disposed on the base plate, wherein the thermal substrate is thermally and electrically coupled to a set of one or more electrodes on the semiconductor power die to reduce a temperature of an active region of the semiconductor power die, wherein the thermal substrate comprises a top metallization layer;
a first set of one of more electrical conductors electrically coupling the set of one or more electrodes to the top metallization layer of the thermal substrate; and
a second set of one or more electrical conductors electrically coupling the top metallization layer of the thermal substrate to the output lead.
12. The semiconductor power device of claim 11 , wherein the semiconductor power device comprises a field effect transistor (FET), and wherein the set of one or more electrodes comprises a set of one or more drain electrodes, respectively.
13. The semiconductor power device of claim 11 , wherein the thermal substrate comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).
14. A semiconductor power device, comprising:
a base plate;
a ring frame disposed on the base plate;
an input lead disposed on the ring frame;
an output lead disposed on the ring frame;
a semiconductor power die disposed on the base plate and surrounded by the ring frame, wherein the semiconductor power die is configured to receive an input signal from the input lead and generate an output signal at the output lead;
a thermal substrate disposed on the base plate, wherein the thermal substrate is thermally and electrically coupled to a set of one or more electrodes on the semiconductor power die to reduce a temperature of an active region of the semiconductor power die, wherein the thermal substrate comprises a top metallization layer;
a first set of one of more electrical conductors electrically coupling the set of one or more electrodes to the top metallization layer of the thermal substrate; and
a second set of one or more electrical conductors electrically coupling the top metallization layer of the thermal substrate to the input lead.
15. The semiconductor power device of claim 14 , wherein the semiconductor power device comprises a field effect transistor (FET), and wherein the set of one or more electrodes comprises a set of one or more gate electrodes, respectively.
16. The semiconductor power device of claim 14 , wherein the thermal substrate comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).
17. A semiconductor power device, comprising:
a base plate;
at least one frame disposed over the base plate;
an input lead disposed over the at least one frame;
an output lead disposed over the at least one frame;
a semiconductor power die disposed over the base plate, wherein the semiconductor power die is configured to receive an input signal from the input lead and generate an output signal at the output lead; and
a thermal substrate disposed over the base plate, wherein the thermal substrate is thermally and electrically coupled to a set of one or more electrodes on the semiconductor power die to reduce a temperature of an active region of the semiconductor power die, wherein the thermal substrate comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).
18. The semiconductor power device of claim 17 , wherein the at least one frame comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).
19. The semiconductor power device of claim 17 , wherein the semiconductor power die comprises a field effect transistor (FET) including at least one gate electrode electrically coupled to the input lead, at least one source electrode electrically coupled to the base plate, and at least one drain electrode electrically coupled to the output lead.
20. A gallium-nitride (GaN) on silicon carbide (SiC) high electron mobility transistor (HEMT), comprising:
a base plate;
at least one frame disposed over the base plate;
an input lead disposed over the at least one frame;
an output lead disposed over the at least one frame;
a semiconductor power die disposed over the base plate, wherein the semiconductor power die includes a set of one or more gate electrodes configured to receive an input signal by way of the input lead, a set of one or more source electrodes electrically coupled to the base plate, and a set of one or more drain electrodes configured to produce an output signal at the output lead;
a first set of one or more electrical conductors by way the set of one or more gate electrodes receive the input signal from the input lead;
a second set of one or more electrical conductors electrically connecting the set of one or more source electrodes to the base plate; and
a third set of one or more electrical conductors by way the set of one or more drain electrodes produce the output signal at the output lead; and
a thermal substrate disposed over the base plate, wherein the thermal substrate is thermally and electrically coupled to the set of one or more gate or drain electrodes on the semiconductor power die to reduce a temperature of an active region of the semiconductor power die, wherein the thermal substrate comprises beryllium oxide (BeO), a silicon carbide (SiC), diamond, or aluminum nitride (AlN).