Integrated multilayer structure for use in sensing applications and method for manufacturing thereof

1. A method for manufacturing an integrated multilayer structure for sensing applications, comprising:

obtaining at least one film comprising a sensing area, the at least one film including a top film and a bottom film;

arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the reactance sensing electronics comprising at least one sensing element and an electrical connection configured to connect the at least one sensing element to an associated control circuitry;

arranging the at least one film so that the top film is positioned closer to a user than the bottom film;

molding or casting, and configuring, at least one plastic layer with a recess defined therein so that the at least one plastic layer defines an integrated, intermediate layer between the reactance sensing electronics and the sensing area and that the sensing area is superimposed with the at least one sensing element of the reactance sensing electronics; and

thermoforming at least one physical feature in a first portion of the bottom film at a location of the sensing area such that the at least one physical feature of the at least one film maintains a protrusion shape that extends from a second portion of the bottom film into the recess of the at least one plastic layer to retain the at least one sensing element on the at least one physical feature and in the recess at a position spaced a distance from the sensing area sufficient to improve a sensing sensitivity of the at least one sensing element and to locally and permanently reduce an electrical distance between the sensing area and the at least one sensing element.

2. The method of claim 1 , wherein at least a portion of the reactance sensing electronics is printed by printed electronics technology, or provided by injection molding or by dip molding.

3. The method of claim 1 , wherein the at least one physical feature comprises an electrically conductive element provided between the sensing area and the at least one sensing element.

4. The method of claim 1 , wherein thermoforming the at least one physical feature comprises 3D forming of the at least one film at the location of the sensing area or the at least one sensing element to define the corresponding protrusion shape such that the protrusion shape extends towards and is overmolded by a material of the at least one plastic layer during molding thereof, thereby locally reducing a thickness of the at least one plastic layer when molded as well as a physical distance between the sensing area and the at least one sensing element.

5. The method of claim 1 , comprising providing a first film of the at least one film and arranging it with the reactance sensing electronics, providing a second film of the at least one film, the second film defining the sensing area, providing the first and second films as inserts in a mold configured so that the sensing area and the at least one sensing element are mutually superimposed, and molding the at least one plastic layer between the sensing area and the at least one sensing element, wherein at least a corresponding portion of the at least one plastic layer with respect to the sensing area is elastic.

6. The method of claim 1 , wherein the at least one physical feature is bent so that the sensing area and the at least one sensing element arranged on the at least one physical feature are mutually superimposed, and molding the at least one plastic layer between the sensing area and the at least one sensing element.

7. The method of claim 1 , comprising provision of an overlay layer upon the at least one film and the sensing area thereof.

8. The method of claim 1 , wherein arranging the at least one film with reactance sensing electronics includes arranging the bottom film with the at least one sensing element.

9. The method of claim 8 , further comprising positioning the bottom film on a lower portion of the at least one plastic layer so that the at least one sensing element is positioned to align with the recess of the at least one plastic layer, and positioning the top film on an upper portion of the at least one plastic layer, the top film including the sensing area.

10. The method of claim 9 , wherein molding or casting, and configuring, at least one plastic layer includes providing the recess with open space arranged within the at least one plastic layer and positioned below the protrusion shape of the at least one physical feature thermoformed in the bottom film.

11. The method of claim 1 , further comprising maintaining the second portion of the at least one film in a planar configuration when the at least one physical feature is thermoformed into the protrusion shape, which is a non-planar configuration.

12. The method of claim 11 , wherein the at least one physical feature is only thermoformed in the first portion of the at least one film.

13. The method of claim 1 , wherein maintaining the protrusion shape includes maintaining the at least one physical feature in the protrusion shape permanently.