Silicone-modified epoxy resin composition and semiconductor device

1. A silicone-modified epoxy resin composition comprising:

(A) a silicone-modified epoxy resin having at least two epoxy groups, obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane having the average compositional formula (1):

H a R b SiO (4-a-b)/2   (1)

wherein R is each independently a C 1 -C 10 monovalent hydrocarbon group, a is a positive number: 0.01≤a≤1, b is a positive number: 1≤b≤3, meeting 1.01≤a+b<4,

(B) a silicone-modified phenolic resin having at least two phenolic hydroxyl groups, obtained from hydrosilylation reaction of an alkenyl-containing phenol compound having the formula:

with an organopolysiloxane having the average compositional formula (1),

(C) a black pigment, and

(D) an inorganic filler exclusive of the black pigment (C).

2. The silicone-modified epoxy resin composition of claim 1 wherein the organopolysiloxane in components (A) and (B) is at least one compound selected from compounds having the formulae (a), (b) and (c):

wherein R is as defined above, R 1 is hydrogen or a group as defined for R, n 1 is an integer of 0 to 200, n 2 is an integer of 0 to 2, n 3 is an integer of 0 to 10, with the proviso that n 1 , n 2 and n 3 are not equal to 0 at the same time, and R 2 is a group having the formula (a′):

wherein R and R 1 are as defined above, n 4 is an integer of 0 to 10, siloxane units each in brackets may be randomly bonded or form blocks, the compound of formula (a) containing at least two silicon-bonded hydrogen atoms per molecule,

wherein R is as defined above, n 5 is an integer of 0 to 10, n 6 is an integer of 2 to 4, meeting 3≤n 5 +n 6 ≤12, the arrangement of siloxane units each in brackets is not limited,

wherein R and R 1 are as defined above, r is an integer of 0 to 3, and R 7 is hydrogen or a C 1 -C 10 organic group, the compound of formula (c) containing at least two silicon-bonded hydrogen atoms per molecule.

3. The silicone-modified epoxy resin composition of claim 1 wherein the inorganic filler (D) is present in an amount of 150 to 1,500 parts by weight per 100 parts by weight of components (A) and (B) combined and 60 to 94% by weight of the total weight of the composition.

4. A semiconductor device encapsulated with a cured product of the silicone-modified epoxy resin composition of claim 1 .

5. The silicone-modified epoxy resin composition of claim 1 wherein the inorganic filler (D) has a chloride ion content of up to 10 ppm and a sodium ion content of up to 10 ppm, when impurities are extracted from the filler in a concentration of sample 10 g/water 50 g under conditions: 125° C., 2.1 atm., and 20 hours.