Light irradiation type heat treatment apparatus and heat treatment method
Pressure in a chamber receiving a semiconductor wafer is reduced to a level less than atmospheric pressure. The semiconductor wafer is subjected to heat treatment in a reduced-pressure atmosphere by being irradiated with a flash of light. A leak determination part determines that a leak occurs at the chamber if pressure in the chamber does not reach target pressure while a time period passed since start of reduction of pressure in the chamber exceeds a threshold set in advance. A leak at the chamber is detected by monitoring a time period passed since start of reduction of pressure in the chamber. This makes it possible to determine the presence or absence of a leak at the chamber with a simple structure without requiring installation of a new hardware structure.
1. A heat treatment method for heating a substrate by irradiating the substrate with light, comprising the steps of:
(a) housing said substrate in a chamber having a quartz window;
(b) reducing pressure in said chamber to a level less than atmospheric pressure;
(c) irradiating said substrate housed in said chamber with light emitted from a light irradiation part through said quartz window; and
(d) determining that a leak occurs in said chamber when the pressure in said chamber reaches to the atmospheric pressure from the reduced pressure within less than a threshold time period.
2. The heat treatment method according to claim 1 , wherein
in said step (c), said substrate is irradiated with a flash of light emitted from a flash lamp.