Resin composition

1. A method of producing a resin composition, the method comprising the step of:

reducing moisture after mixing each component of the resin composition, wherein the resin composition comprises the following components:

(A) an alicyclic epoxy compound;

(B) a bisphenol A epoxy resin;

(C) a bisphenol F epoxy resin; and

(D) a photocationic polymerization initiator,

wherein the bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A),

an amount of component (A) is 40 parts by mass or more based on 100 parts by mass of (A), (B), and (C) in total, and

the resin composition satisfies any one of the following characteristics of the items (i) and (ii):

(i) the resin composition has a moisture content of 1000 ppm or less, and

(ii) the resin composition further comprises a filler (H) and has a moisture content of 50 ppm or more.

2. The method according to claim 1 , wherein

the step of reducing moisture after mixing each component includes one or more steps selected from the group consisting of:

(a) removing moisture by desiccant, and after removing moisture, separating the desiccant by decantation or filtration;

(b) removing moisture by heating in a reduced pressure;

(c) distillation purification in a reduced pressure;

(d) removing moisture by blowing an inert gas into each component; and

(e) removing moisture by freeze drying.

3. The method according to claim 1 , wherein the resin composition further comprises a stabilizer (E).

4. The method according to claim 3 wherein the stabilizer (E) is an ether compound.

5. The method according to claim 4 , wherein the stabilizer (E) is a cyclic ether compound.

6. The method according to claim 1 , wherein the alicyclic epoxy compound (A) does not have an aromatic group.

7. The method according to claim 1 , wherein the resin composition further comprises a silane coupling agent (F).

8. The method according to claim 1 , wherein the resin composition further comprises a sensitizer (G).

9. The method according to claim 1 , wherein the resin composition has a moisture content from not less than 50 ppm to not more than 700 ppm.

10. The method according to claim 1 , wherein the resin composition has shear viscosity not less than 5 mPa·s and not more than 2000 mPa·s at 25° C.

11. A sealant for an organic EL device, comprising the resin composition produced by the method according to claim 1 .

12. A cured article comprising the resin composition produced by the method according to claim 1 , the resin composition being cured therein.

13. An organic EL apparatus comprising the resin composition produced by the method according to claim 1 , the resin composition being used therein.

14. A display comprising the resin composition produced by the method according to claim 1 , the resin composition being used therein.

15. A display or an organic EL apparatus with flexibility comprising the resin composition produced by the method according to claim 1 , the resin composition being used therein.

16. A method of manufacturing an organic EL apparatus, comprising the steps of:

irradiating light after applying the sealant for an organic EL device according to claim 11 on all or part of a surface of a base material; and

sealing an organic EL device by laminating the base material and the organic EL device by the time the sealant for an organic EL device is cured.