Boiling cooling device
View Patent ↗A boiling cooling device e includes a power semiconductor that is vertically disposed, heat radiating plates provided on both side faces of the power semiconductor, heat receiving jackets provided at both sides of the power semiconductor and covering the heat radiating plates, refrigerant filled in the heat receiving jackets and being in contact with the heat radiating plates, a condenser connected to the heat receiving jackets, and fine longitudinal grooves formed on a heat radiating face of the heat radiating plate and extending in a vertical direction, where creation of air bubbles is promoted by heat generated in the power semiconductor and by the fine longitudinal grooves, the created air bubbles rising and passing through a forward pipe and then reaching the condenser to be liquefied, such that liquid is returned to the heat receiving jacket via a return pipe.
1. A boiling cooling device, comprising:
a power semiconductor that is vertically disposed;
heat radiating plates provided on left and right side faces of the power semiconductor, respectively;
heat receiving jackets provided at left and right sides of the power semiconductor, and configured to cover the heat radiating plates, respectively;
refrigerant filled in the heat receiving jackets and configured to be in direct contact with the heat radiating plates;
a condenser connected to the heat receiving jackets via a forward pipe and a return pipe; and
a plurality of fine longitudinal grooves formed on a heat radiating face of the heat radiating plate and extending in a vertical direction,
wherein heat generated in the power semiconductor and the fine longitudinal groove provided on the heat radiating face are configured to create air bubbles that rise and pass through the forward pipe and then reach the condenser to be liquefied, such that liquid is returned to the heat receiving jackets via the return pipe.
2. The boiling cooling device of claim 1 , wherein each of the fine longitudinal grooves has a width of 50 μm or less.
3. The boiling cooling device of claim 2 , wherein each of the fine longitudinal grooves is formed by laser machining of the heat radiating face.
4. The boiling cooling device of claim 1 , wherein each of the fine longitudinal grooves is formed by laser machining of the heat radiating face.
5. A boiling cooling device, comprising:
a power semiconductor that is vertically disposed;
heat radiating plates provided on left and right side faces of the power semiconductor, respectively;
heat receiving jackets provided at left and right sides of the power semiconductor, and configured to cover the heat radiating plates, respectively;
refrigerant filled in the heat receiving jackets and configured to be in direct contact with the heat radiating plates;
a condenser connected to the heat receiving jackets via a forward pipe and a return pipe; and
mesh-shaped grooves formed on a heat radiating face of the heat radiating plate and comprising a plurality of fine longitudinal grooves extending in a vertical direction and a plurality of fine transverse grooves intersecting the fine longitudinal grooves and extending in a horizontal direction,
wherein heat generated in the power semiconductor and the mesh-shaped grooves provided on the heat radiating face are configured to create air bubbles that rise and pass through the forward pipe and then reach the condenser to be liquefied, such that liquid is returned to the heat receiving jacket via the return pipe.
6. The boiling cooling device of claim 5 , wherein each of the fine longitudinal grooves has a width of 50 μm or less.
7. The boiling cooling device of claim 6 , wherein each of the fine longitudinal grooves is formed by laser machining of the heat radiating face.
8. The boiling cooling device of claim 5 , wherein each of the fine longitudinal grooves is formed by laser machining of the heat radiating face.