Multilayer ceramic electronic component
A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.
1. A multilayer ceramic electronic component comprising:
a body including an internal electrode alternately arranged with a dielectric layer; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.
2. The multilayer ceramic electronic component of claim 1 , wherein a thickness of the composite layer including tin (Sn) and nickel (Ni) is within a range from 1 to 15 nm.
3. The multilayer ceramic electronic component of claim 1 , wherein, in the composite layer, a molar ratio of tin (Sn) is greater than or equal to 0.0001, based on a total content of the composite layer.
4. The multilayer ceramic electronic component of claim 1 , wherein the composite layer including tin (Sn) and nickel (Ni) substantially encloses at least one of the nickel (Ni) grains.
5. The multilayer ceramic electronic component of claim 1 , wherein a thickness of the dielectric layer is 0.4 μm or less, and a thickness of the internal electrode is 0.4 μm or less.
6. The multilayer ceramic electronic component of claim 1 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.
7. The multilayer ceramic electronic component of claim 1 ,
wherein the internal electrode is formed of an internal electrode paste including a nickel (Ni) powder having a coating layer including tin (Sn) on a surface thereof, or a nickel-tin alloy (Ni—Sn) powder, and
wherein a content of tin (Sn) is 1.5 wt % or more, based on a total weight of the nickel (Ni).
8. The multilayer ceramic electronic component of claim 7 , wherein an average particle diameter of the nickel (Ni) powder powder is 100 nm or less.
9. The multilayer ceramic electronic component of claim 7 , wherein the nickel (Ni) powder further includes sulfur (S), and a content of the sulfur (S) is less than or equal to of 300 ppm (excluding 0), based on a total content of the nickel (Ni) powder.
10. The multilayer ceramic electronic component of claim 1 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
11. A multilayer ceramic electronic component comprising:
a body including an internal electrode alternately arranged with a dielectric layer; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains,
wherein the dielectric layer includes a plurality of dielectric grains,
wherein tin (Sn) is included at a grain boundary of the plurality of dielectric grains,
wherein a portion of the plurality of dielectric grains have a core-shell structure, and
wherein tin (Sn) is included in a shell of the dielectric grains having the core-shell structure.
12. The multilayer ceramic electronic component of claim 11 , wherein, in the shell of the dielectric grains having the core-shell structure, a molar ratio of tin (Sn) is greater than or equal to 0.0001, based on a total content of the shell.
13. The multilayer ceramic electronic component of claim 11 , wherein among the plurality of dielectric grains, dielectric grains having the core-shell structure are 20% or more of the total number of dielectric grains.
14. The multilayer ceramic electronic component of claim 11 , wherein a thickness of the dielectric layer is 0.4 μm or less, and a thickness of the internal electrode is 0.4 μm or less.
15. The multilayer ceramic electronic component of claim 11 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
16. The multilayer ceramic electronic component of claim 11 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.