Electronic device
An electronic device includes an electronic component, a sealing resin body, and a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to the outside of the sealing resin body, and having different potentials. The conductive members include a heat sink and a terminal extending from an inside to the outside of the sealing resin body. A surface of the terminal includes, as a part covered with the sealing resin body, a higher adhesion part and a lower adhesion part. The lower adhesion part is provided in an entire portion of a back surface of the terminal, the back surface being opposite to a connection surface of the terminal which is adjacent to a connection part electrically connected to the electronic component. The higher adhesion part is provided in the connection surface.
1. An electronic device, comprising:
at least one electronic component;
a sealing resin body sealing the electronic component; and
a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to an outside of the sealing resin body, and having different potentials, wherein
the plurality of conductive members include a heat sink and a terminal, the terminal extending from an inside of the sealing resin body to the outside of the sealing resin body,
a surface of the terminal includes a higher adhesion surface and a lower adhesion surface, the higher adhesion surface and the lower adhesion surface being covered with the sealing resin body, and the lower adhesion surface has an adhesion strength to the sealing resin body that is lower than an adhesion strength of the higher adhesion surface to the sealing resin body, and
the lower adhesion surface is provided in an entire portion of a back surface of the terminal, the back surface being opposite to a connection surface of the terminal which is adjacent to a connection part electrically connected to the electronic component, and
the higher adhesion surface is provided in the connection surface.
2. The electronic device according to claim 1 , wherein
the higher adhesion surface is provided at least in a portion of the connection surface which is located between the connected part and an outer peripheral end of the sealing resin body and extending from the connected part.
3. The electronic device according to claim 2 , wherein
the higher adhesion surface is provided in an entire portion of the connection surface which is located between the connected part and the outer peripheral end of the sealing resin body.
4. The electronic device according to claim 2 , wherein
the higher adhesion surface surrounds the connected part of the connection surface.
5. An electronic device, comprising:
at least one electronic component;
a sealing resin body sealing the electronic component; and
a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to an outside of the sealing resin body, and having different potentials, wherein
the plurality of conductive members include a heat sink and a terminal, the terminal extending from an inside of the sealing resin body to the outside of the sealing resin body,
a surface of the terminal has, as a part covered with the sealing resin body, a higher adhesion part and a lower adhesion part, and the lower adhesion part has an adhesion to the sealing resin body which is lower than an adhesion of the higher adhesion part to the sealing resin body, and
the lower adhesion part is provided in an entire portion of a back surface of the terminal, the back surface being opposite to a connection surface of the terminal which is adjacent to a connection part electrically connected to the electronic component, and
the higher adhesion part is provided in the connection surface, wherein
of the higher adhesion part and the lower adhesion part, only the higher adhesion part has a roughened surface.
6. The electronic device according to claim 1 , wherein
of the higher adhesion surface and the lower adhesion surface, only the higher adhesion surface is provided with a polymer film which enhances an adhesion to the sealing resin body.
7. The electronic device according to claim 1 , which is used for a power conversion device.
8. An electronic device, comprising:
at least one electronic component;
a sealing resin body sealing the electronic component; and
a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to an outside of the sealing resin body, and having different potentials, wherein
the plurality of conductive members include an external connection terminal extending from an inside of the sealing resin body to the outside of the sealing resin body,
a surface of the external connection terminal includes a higher adhesion surface and a lower adhesion surface, the higher adhesion surface and the lower adhesion surface being covered with the sealing resin body and excluding a connection part electrically connected to the electronic component, and the lower adhesion surface has an adhesion strength to the sealing resin body that is lower than an adhesion strength of the higher adhesion surface to the sealing resin body, and
in a predetermined region from an outer peripheral end of the sealing resin body along an extending direction of the external connection terminal, the higher adhesion surface is provided in a connection surface which includes the connected part, and the lower adhesion surface is provided in a back surface opposite to the connection surface in a thickness direction.
9. The electronic device according to claim 8 , wherein
the lower adhesion surface is provided in an entire portion of the back surface which is covered with the sealing resin body.
10. The electronic device according to claim 8 , wherein
the lower adhesion surface is provided only in a portion of the back surface in the extending direction.
11. The electronic device according to claim 8 , wherein
the higher adhesion surface is provided at least in a portion of the connection surface which is located between the connected part and the outer peripheral end of the sealing resin body and extending from the connected part.
12. The electronic device according to claim 11 , wherein
the higher adhesion surface is provided in an entire portion of the connection surface which is located between the connected part and the outer peripheral end of the sealing resin body.
13. The electronic device according to claim 11 , wherein
the higher adhesion surface surrounds the connected part of the connection surface.
14. An electronic device, comprising:
at least one electronic component;
a sealing resin body sealing the electronic component; and
a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to an outside of the sealing resin body, and having different potentials, wherein
the plurality of conductive members include an external connection terminal extending from an inside of the sealing resin body to the outside of the sealing resin body,
a surface of the external connection terminal has, as a part covered with the sealing resin body and excluding a connection part electrically connected to the electronic component, a higher adhesion part and a lower adhesion part, and the lower adhesion part has an adhesion to the sealing resin body which is lower than an adhesion of the higher adhesion part to the sealing resin body, and
in a predetermined region from an outer peripheral end of the sealing resin body along an extending direction of the external connection terminal, the higher adhesion part is provided in a connection surface which includes the connected part, and the lower adhesion part is provided in a back surface opposite to the connection surface in a thickness direction, wherein
of the higher adhesion part and the lower adhesion part, only the higher adhesion part has a roughened surface.
15. The electronic device according to claim 8 , wherein
of the higher adhesion surface and the lower adhesion surface, only the higher adhesion surface is provided with a polymer film which enhances an adhesion to the sealing resin body.
16. The electronic device according to claim 8 , which is used for a power conversion device.
17. The electronic device according to claim 1 , wherein both the higher adhesion surface and the lower adhesion surface are directly in contact with the sealing resin body.
18. The electronic device according to claim 8 , wherein both the higher adhesion surface and the lower adhesion surface are directly in contact with the sealing resin body.