Chip package assembly with modular core dice
A chip package assembly and method for fabricating the same are provided which utilize at least one modular core dice to reduce the cost of manufacture. The modular core dice include at least two die disposed on a wafer segment that are separated by a scribe lane. In one example, a chip package assembly is provided that includes an interconnect substrate stacked below a first wafer segment. The first wafer segment has a first die spaced from a second die by a first scribe lane. The interconnect substrate has conductive routing that is electrically connected to the first die and the second die through die connections.
1. A chip package assembly comprising:
a first wafer segment having a first die spaced from a second die by a first scribe lane, sidewalls of the first die, the second die, and the first scribe lane physically contact by silicon of the first wafer segment;
an interconnect substrate stacked below the first wafer segment, the interconnect substrate having conductive routing electrically connected to the first die and the second die through die connections; and
a first diced die mechanically and electrically connected to the first die through die connections, wherein the first diced die is detached from all other dice along the scribe lanes bounding all sides of the first diced die such that first diced die is a single, independent and unitary die.
2. The chip package assembly of claim 1 , wherein the first die and the second die are not directly electrically connected by conductors routed across the first scribe lane of the first wafer segment.
3. The chip package assembly of claim 1 , wherein the first wafer segment further comprises:
a third die separated from the first die by a second scribe lane.
4. The chip package assembly of claim 3 , wherein the first wafer segment further comprises:
a fourth die separated from the second die by the first scribe lane.
5. The chip package assembly of claim 4 , wherein the third die and the fourth die are not directly electrically connected by conductors routed across first scribe lane; and the third die and the first die are not directly electrically connected by conductors routed across second scribe lane.
6. The chip package assembly of claim 1 further comprising:
a second wafer segment stacked on the first wafer segment, the second wafer segment having a first die spaced from a second die by a scribe lane, the first die of the first wafer segment electrically and mechanically coupled to the first die of the second wafer segment by die connections, and the second die of the first wafer segment electrically and mechanically coupled to the second die of the second wafer segment.
7. The chip package assembly of claim 6 , wherein a number of dice comprising the second wafer segment is equal to a number of dice comprising the first wafer segment.
8. The chip package assembly of claim 1 , wherein the interconnect substrate is an I/O die that is mechanically connected to the first wafer segment via the die connections.
9. The chip package assembly of claim 8 further comprising:
a package substrate stacked below the I/O die, the package substrate electrically and mechanically coupled to the I/O die by die connections.
10. The chip package assembly of claim 1 , wherein the first die and the second die are different.
11. The chip package assembly of claim 6 , wherein the first and second wafer segments have the same number, type and arrangement of dice.
12. The chip package assembly of claim 6 , wherein the first and second wafer segments have one or more of a different number, type and arrangement of dice.
13. The chip package assembly of claim 1 , wherein the first diced die is disposed between the interconnect substrate and the first wafer segment.
14. The chip package assembly of claim 1 , wherein the first wafer segment is disposed between the interconnect substrate and the first diced die.
15. The chip package assembly of claim 6 , wherein the first die and the second die are different.
16. The chip package assembly of claim 6 , wherein the first and second diced dice are disposed between the interconnect substrate and the first wafer segment.
17. The chip package assembly of claim 6 , wherein the first wafer segment is disposed between the interconnect substrate and the first and second diced dice.
18. A chip package assembly comprising:
a first wafer segment having a first die spaced from a second die by a first scribe lane, sidewalls of the first die, the second die, and the first scribe lane physically contact by silicon of the first wafer segment;
an interconnect substrate stacked below the first wafer segment, the interconnect substrate having conductive routing electrically connected to the first die and the second die through die connections;
a first diced die mechanically and electrically connected to the first die through die connections; and
a second diced die mechanically and electrically connected to the second die through die connections, the first and second diced dice lateral separated by an air gap or molding, wherein the first and second diced dies each are detached from all other dice along the scribe lanes bounding all sides of the first and second diced dies such that first and second diced dies each is single, independent and unitary die.