IP Library › Granted Patent US 10,692,910
Granted Patent B2
US 10,692,910 · App. 16/081,651 · Granted Jun 23, 2020

Solid-state imaging element and electronic device

Inventors: Kyohei Mizuta (Kanagawa, JP); Takuya Maruyama (Kanagawa, JP); Yukihiro Ando (Kanagawa, JP)
Assignee: SONY CORPORATION
H01L27/14623H01L27/1463H01L27/1464H01L27/14603H01L27/14612H01L27/14614H01L27/14645
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Quick Facts
Patent No.
US 10,692,910
App. No.
16/081,651
Granted
Jun 23, 2020
Kind
B2
Abstract

The present disclosure relates to a solid-state imaging element capable of suppressing stray light with respect to a charge storage unit such as an FD, and an electronic device. According to an aspect of the present disclosure, a solid-state imaging element constituted by many pixels includes a photoelectric conversion unit formed for each of the pixels and that converts incident light into a charge; a charge storage unit that temporarily holds the converted charge; and a first light shielding unit formed between the pixels and having a predetermined length in a thickness direction of a substrate. The charge storage unit is formed below a cross portion where the first light shielding unit formed between pixels adjacent to each other in a longitudinal direction crosses the first light shielding unit formed between pixels adjacent to each other in a lateral direction. The present disclosure can be applied to, for example, a backside irradiation type CMOS image sensor.

Claims (55)

1. A solid-state imaging element, comprising:

a plurality of pixels;

a photoelectric conversion unit for each pixel of the plurality of pixels, wherein the photoelectric conversion unit is configured to convert incident light into a charge;

a charge storage unit configured to temporarily hold the charge;

a first light shielding unit between the plurality of pixels and having a determined length in a thickness direction of a substrate, wherein

the charge storage unit is below a cross portion where the first light shielding unit between a plurality of first pixels adjacent to each other in a longitudinal direction crosses the first light shielding unit between a plurality of second pixels adjacent to each other in a lateral direction; and

a second light shielding unit covering a light incident surface side of the cross portion.

2. The solid-state imaging element according to claim 1 , wherein

the cross portion is in a columnar shape or a polygonal pillar shape.

3. The solid-state imaging element according to claim 1 , wherein

the cross portion is in a cylindrical shape or a polygonal tubular shape.

4. The solid-state imaging element according to claim 3 , wherein

the charge storage unit is extended in the thickness direction of the substrate in a tube of the cross portion formed in a tubular shape.

5. The solid-state imaging element according to claim 1 , wherein

the first light shielding unit and the cross portion are formed individually at different etching rates.

6. The solid-state imaging element according to claim 1 , further comprising:

a TG transistor;

an AMP transistor;

a SEL transistor;

an OFG transistor; and

an RST transistor, wherein

the charge storage unit and a source of the RST transistor are integrally formed.

7. The solid-state imaging element according to claim 6 , further comprising a feedback enable (FBEN) transistor configured to suppress reset noise.

8. The solid-state imaging element according to claim 6 , wherein

a drain of the AMP transistor and a drain of the RST transistor share a wire and are connected to a VDD.

9. The solid-state imaging element according to claim 1 , further comprising a moth eye structure unit configured to irregularly reflect the incident light to the photoelectric conversion unit.

10. The solid-state imaging element according to claim 1 , wherein

in the first light shielding unit, lengths in a planar direction of the substrate in adjacent pixel regions are different from each other.

11. The solid-state imaging element according to claim 1 , wherein

in the first light shielding unit, lengths in the thickness direction of the substrate in adjacent pixel regions are different from each other.

12. The solid-state imaging element according to claim 1 , wherein

the photoelectric conversion unit of a first pixel of the plurality of pixels has a different volume from the photoelectric conversion unit of a second pixel of the plurality of pixels, and

the second pixel is adjacent to the first pixel.

13. The solid-state imaging element according to claim 1 , wherein

the plurality of pixels includes:

at least a first pixel sensitive to light having a first wavelength;

a second pixel sensitive to a second wavelength longer than the first wavelength; and

a third pixel sensitive to a third wavelength longer than the second wavelength.

14. The solid-state imaging element according to claim 13 , wherein

in the first light shielding unit between the first pixel or the second pixel and the third pixel, a length in a planar direction of the substrate in a region of the third pixel is longer than that in a region of the first pixel or the second pixel.

15. The solid-state imaging element according to claim 13 , wherein

in the first light shielding unit between the first pixel or the second pixel and the third pixel, a length in the thickness direction of the substrate in a region of the third pixel is longer than that in a region of the first pixel or the second pixel.

16. The solid-state imaging element according to claim 13 , wherein

the photoelectric conversion unit of the third pixel has a smaller volume than the photoelectric conversion unit of the first pixel or the second pixel.

17. The solid-state imaging element according to claim 13 , wherein

the charge storage unit between the first pixel or the second pixel and the third pixel is at a position closer to the first pixel or the second pixel than the third pixel.

18. The solid-state imaging element according to claim 1 , wherein the charge storage unit is shared by the plurality of pixels.

19. An electronic device, comprising:

a solid-state imaging element, wherein the solid-state imaging element comprises:

a plurality of pixels;

a photoelectric conversion unit for each pixel of the plurality of pixels, wherein the photoelectric conversion unit is configured to convert incident light into a charge;

a charge storage unit configured to temporarily hold the charge;

a first light shielding unit between the plurality of pixels and having a determined length in a thickness direction of a substrate, wherein

the charge storage unit is below a cross portion where the first light shielding unit between a plurality of first pixels adjacent to each other in a longitudinal direction crosses the first light shielding unit between a plurality of second pixels adjacent to each other in a lateral direction; and

a second light shielding unit covering a light incident surface side of the cross portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2018
From: MIZUTA, KYOHEI; MARUYAMA, TAKUYA; ANDO, YUKIHIRO
To: SONY CORPORATION
Reel/Frame 046996/0418 →
Priority Claims (1)
JP 2016-050964 · Mar 15, 2016 · national
Continuity (1)
Related Publication 20190088701A1 · Mar 21, 2019