IP Library › Granted Patent US 10,693,049
Granted Patent B2
US 10,693,049 · App. 15/771,281 · Granted Jun 23, 2020

Light emitting device package and lighting system comprising same

Inventors: Keal Doo Moon (Seoul, KR); Dong Yong Lee (Seoul, KR); Sang Jun Lee (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
H01L33/60H01L33/46H01L33/465H01L33/502H01L33/505H01L33/508H01L33/62H01L33/382H01L2933/0016H01L2933/0066
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Quick Facts
Patent No.
US 10,693,049
App. No.
15/771,281
Granted
Jun 23, 2020
Kind
B2
Abstract

One embodiment relates to a light emitting device package having improved luminous flux, and a light emitting device package, according to one embodiment of the present invention, comprises: a light emitting device having an electrode pad arranged at a lower surface thereof; a wavelength conversion layer for covering four lateral surfaces of the light emitting device; a first reflective pattern for covering an upper surface of the light emitting device and three lateral surfaces of the light emitting device so as to expose the wavelength conversion layer of the one remaining lateral surface, which is a light emitting surface of the light emitting device; and a second reflective pattern arranged between the first reflective pattern and the upper surface of the light emitting device.

Claims (19)

1. A light emitting device package comprising:

a light emitting device including a lower surface, an upper surface opposite to the lower surface, and a side surface disposed between the lower surface and the upper surface;

a wavelength conversion member disposed on the light emitting device;

a first reflective member disposed on the wavelength conversion member; and

a second reflective member disposed between the first reflective member and the light emitting device,

wherein the side surface of the light emitting device includes a light extractive side surface and a reflective side surface,

wherein the second reflective member contacts the upper surface of the light emitting device and the reflective side surface of the light emitting device,

wherein the wavelength conversion member includes a light extractive side plane, a covered side plane, an upper plane, and a lower plane,

wherein the first reflective member covers the covered side plane and the upper plane of the wavelength conversion member,

wherein the lower surface of the light emitting device and the light extractive side plane of the wavelength conversion member are exposed,

wherein a side surface of the second reflective member is between the side surface of the light emitting device and the covered side plane of the wavelength conversion member and covers the reflective side surface of the light emitting device, and

wherein the side surface of the second reflective member is opened between the light extractive side plane of the wavelength conversion member and the light extractive side surface of the light emitting device.

2. The light emitting device package of claim 1 , wherein the wavelength conversion member is further disposed between the second reflective member and the upper surface of the light emitting device.

3. The light emitting device package of claim 1 , wherein the second reflective member further surrounds the reflective side surface of the light emitting device, and

wherein the covered side plane and the upper plane of the wavelength conversion member contact all side surfaces of the first reflective member and the second reflective member.

4. The light emitting device package of claim 1 , further comprising a third reflective member disposed between the first reflective member and the light emitting device.

5. The light emitting device package of claim 1 , wherein the first reflective member includes white silicone, such as phenyl silicone or methyl silicone, or silicone including reflective particles.

6. The light emitting device package of claim 1 , wherein the second reflective member includes a distributed Bragg reflector (DBR) layer.

7. The light emitting device package of claim 4 , wherein the third reflective member includes a metal, such as Ag or Al, or a metal oxide such as TiO 2 , Al 2 O 3 , or ZrO 2 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2018
From: MOON, KEAL DOO; LEE, DONG YONG; LEE, SANG JUN
To: LG INNOTEK CO., LTD.
Reel/Frame 045980/0318 →
Priority Claims (2)
KR 10-2015-0148855 · Oct 26, 2015 · national
KR 10-2015-0149181 · Oct 27, 2015 · national
Continuity (1)
Related Publication 20180358520A1 · Dec 13, 2018
Cited By (4)
US 12,266,742 US 12,288,834 US 12,317,651 US 12,426,416