Sam assisted selective e-less plating on packaging materials
A method including activating an area of a polymer layer on a substrate with electromagnetic radiation; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with the self-assembled monolayer; and reacting the self-assembled monolayer with a conductive material. A method including activating an area of a polymer dielectric layer on a substrate with electromagnetic radiation, the area selected for an electrically conductive line; modifying the activated area; forming a self-assembled monolayer on the modified active area; reacting the self-assembled monolayer with a catalyst; and electroless plating a conductive material on the self-assembled monolayer.
1. An integrated circuit chip package substrate comprising a plurality of conductive lines formed on a radiation-activated dielectric material, the conductive lines formed of conductive material chemically bonded to the dielectric material through a self-assembled monolayer.
2. The substrate of claim 1 , wherein the conductive material is chemically bonded to the self-assembled monolayer through a catalyst.
3. The substrate of claim 1 , wherein the dielectric material comprises a polymer material.
4. A method comprising:
activating an area of a polymer layer on a package substrate by exposing portions of a surface of the polymer layer to electromagnetic radiation;
modifying the activated area;
forming a self-assembled monolayer on the modified active area;
reacting the self-assembled monolayer with a catalyst; and
reacting the self-assembled monolayer with a conductive material.
5. The method of claim 4 , wherein modifying the activated area comprises forming a hydroxyl ion rich area.
6. The method of claim 4 , wherein the self-assembled monolayer comprises a functional group operable to react with the catalyst.
7. The method of claim 6 , wherein the functional group comprises one of an amine moiety, a sulfhydryl moiety and a pyridil moiety.
8. The method of claim 4 , wherein the catalyst is a metal and reacting the self-assembled monolayer with a conductive material comprises reducing the catalyst in a bath comprising a reducing agent and an ionic form of the conductive material.
9. The method of claim 8 , wherein reacting the self-assembled monolayer with a conductive material comprises reducing the state of the ionic form of conductive material.
10. A method comprising:
activating an area of a polymer dielectric layer on a substrate by exposing portions of a surface of the polymer layer to electromagnetic radiation, the area selected for an electrically conductive line;
modifying the activated area;
forming a self-assembled monolayer on the modified active area;
reacting the self-assembled monolayer with a catalyst; and
electroless plating a conductive material on the self-assembled monolayer.
11. The method of claim 10 , wherein modifying the activated area comprises forming a hydroxyl ion rich area.
12. The method of claim 10 , wherein the self-assembled monolayer comprises a functional group operable to react with the catalyst.
13. The method of claim 12 , wherein the functional group comprises one of an amine moiety, a sulfhydryl moiety and a pyridil moiety.
14. The method of claim 10 , wherein the catalyst comprises palladium.
15. The method of claim 10 , wherein electroless plating a conductive material comprises reducing the catalyst in a bath comprising a reducing agent that is oxidized.
16. The method of claim 15 , wherein the bath comprises an ionic form of the conductive material in an oxidized state and electroless plating a conductive material comprises reducing the state of the ionic form of the conductive material.
17. The method of claim 10 , wherein the substrate comprises a package substrate.