IP Library › Granted Patent US 10,697,084
Granted Patent B2
US 10,697,084 · App. 16/205,307 · Granted Jun 30, 2020

High resistance virtual anode for electroplating cell

Inventors: Po-Wei Wang (Taichung, TW); Chun-Lin Chang (Jhubei, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
C25D17/12C25D7/12C25D17/001C25D17/007C25D17/008
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Quick Facts
Patent No.
US 10,697,084
App. No.
16/205,307
Granted
Jun 30, 2020
Kind
B2
Abstract

A high resistance virtual anode for an electroplating cell includes a first layer and a second layer. The first layer includes a plurality of first holes through the first layer. The second layer is over the first layer and includes a plurality of second holes through the second layer.

Claims (54)

1. A method, comprising:

receiving an electroplating cell, the electroplating cell comprising:

a substrate holder for holding a substrate;

a plating bath;

an anode in the plating bath; and

a high resistance virtual anode in the plating bath, the high resistance virtual anode comprising:

a first layer comprising a plurality of first holes through the first layer, wherein:

the first layer comprises a rotatable central portion and a rotatable peripheral portion surrounding the rotatable central portion,

a first portion of the first holes are through the rotatable central portion of the first layer, and

a second portion of the first holes are through the rotatable peripheral portion of the first layer; and

a second layer over the first layer and comprising a plurality of second holes through the second layer;

rotating at least one of the rotatable central portion or the rotatable peripheral portion;

mounting the substrate in the substrate holder;

placing the substrate holder and the substrate into the plating bath such that the high resistance virtual anode is between a surface of the substrate and the anode; and

generating an electric current flux between the substrate and the anode and through the high resistance virtual anode to shape the electric current flux and to form an electroplating layer over the surface of the substrate.

2. The method of claim 1 , wherein a percentage of the electric current flux passing through a center of the high resistance virtual anode is higher than a percentage of the electric current flux passing through a periphery of the high resistance virtual anode.

3. The method of claim 1 , wherein rotating the at least one of the rotatable central portion or the rotatable peripheral portion is conducted by a programmable controller.

4. The method of claim 1 , wherein at least one of:

rotating the at least one of the rotatable central portion or the rotatable peripheral portion comprises rotating the rotatable central portion independently of the rotatable peripheral portion, or

rotating the at least one of the rotatable central portion or the rotatable peripheral portion comprises rotating the rotatable peripheral portion independently of the rotatable central portion.

5. The method of claim 1 , comprising rotating the substrate holder and the substrate while generating the electric current flux.

6. The method of claim 1 , wherein:

the substrate holder comprises a cup portion and a cone portion, and

the method comprises using an air cylinder to provide a vertical force for engaging the cup portion with the cone portion.

7. The method of claim 1 , comprising sealing a peripheral edge of the high resistance virtual anode to an edge of the plating bath.

8. The method of claim 1 , wherein the rotatable central portion has an opening ratio higher than an opening ratio of the rotatable peripheral portion.

9. The method of claim 1 , wherein a hole of the first portion of the first holes has a diameter greater than a diameter of a hole of the second portion of the first holes.

10. The method of claim 1 , wherein a hole of the first portion of the first holes has a maximum depth less than a depth of a hole of the second portion of the first holes.

11. The method of claim 1 , wherein the rotatable peripheral portion comprises a plurality of rotatable ring-shaped portions coaxially surrounding the rotatable central portion.

12. The method of claim 1 , wherein a center of one of the first layer or the second layer has a thickness less than a thickness of a periphery of the one of the first layer or the second layer.

13. The method of claim 1 , wherein a thickness of one of the first layer or the second layer is gradually increased from a center to a periphery.

14. A method, comprising:

receiving an electroplating cell, the electroplating cell comprising:

an anode; and

a high resistance virtual anode comprising:

a first layer comprising a plurality of first holes through the first layer, wherein the first layer comprises a rotatable central portion and a rotatable peripheral portion surrounding the rotatable central portion; and

a second layer over the first layer and comprising a plurality of second holes through the second layer;

rotating at least one of the rotatable central portion or the rotatable peripheral portion; and

generating an electric current flux between a substrate and the anode and through the high resistance virtual anode to shape the electric current flux and to form an electroplating layer over a surface of the substrate.

15. The method of claim 14 , wherein at least one of:

rotating the at least one of the rotatable central portion or the rotatable peripheral portion comprises rotating the rotatable central portion independently of the rotatable peripheral portion, or

rotating the at least one of the rotatable central portion or the rotatable peripheral portion comprises rotating the rotatable peripheral portion independently of the rotatable central portion.

16. The method of claim 14 , comprising sealing a peripheral edge of the high resistance virtual anode to a wall of the electroplating cell.

17. The method of claim 14 , wherein a percentage of the electric current flux passing through a center of the high resistance virtual anode is higher than a percentage of the electric current flux passing through a periphery of the high resistance virtual anode.

18. A method, comprising:

receiving an electroplating cell, the electroplating cell comprising:

an anode; and

a high resistance virtual anode comprising:

a first layer comprising a plurality of first holes through the first layer, wherein the first layer comprises a rotatable central portion and a rotatable peripheral portion surrounding the rotatable central portion, and

a second layer over the first layer and comprising a plurality of second holes through the second layer;

sealing a peripheral edge of the high resistance virtual anode to a wall of the electroplating cell; and

generating an electric current flux between a substrate and the anode and through the high resistance virtual anode to shape the electric current flux and to form an electroplating layer over a surface of the substrate.

19. The method of claim 18 , wherein a center of one of the first layer or the second layer has a thickness less than a thickness of a periphery of the one of the first layer or the second layer.

20. The method of claim 18 , wherein a thickness of one of the first layer or the second layer is gradually increased from a center to a periphery.

Continuity (3)
Division 15154986 · May 14, 2016
Provisional Application 62261209 · Nov 30, 2015
Related Publication 20190100854A1 · Apr 4, 2019