IP Library Granted Patent US 10,701,849
Granted Patent B2
US 10,701,849 · App. 15/595,981 · Granted Jun 30, 2020

Component placement machine and component placement method

Inventors: Shinji Yamamoto (Yamanashi, JP); Koji Sakurai (Yamanashi, JP); Hiroyuki Fujiwara (Yamanashi, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
H05K13/0015H05K13/0061H05K13/0069H05K13/04Y10T29/53174
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,701,849
App. No.
15/595,981
Granted
Jun 30, 2020
Kind
B2
Abstract

A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.

Claims (23)

1. A component placement machine installing a component by an installation head and with respect to a board arranged at a working position, the component placement machine comprising:

a board supporter supporting a lower surface of the board arranged at the working position;

a plurality of support pins attached to the board supporter, each of the plurality of support pins having a fixed height;

a plurality of height measuring instruments attached to the board supporter, each of the plurality of height measuring instruments having a height exceeding the fixed height of the plurality of support pins, wherein the plurality of height measuring instruments are configured to measure heights of a plurality of portions of the lower surface of the board; and

a controller configured to control an operation of the installation head by controlling an installation height of a component with respect to the board based on the measured heights of the plurality of portions of the lower surface of the board.

2. The component placement machine of claim 1 ,

wherein the controller estimates a shape of the board based on the heights of the plurality of portions and controls a height of the installation head and with respect to the board based on the estimated shape of the board.

3. The component placement machine of claim 1 ,

wherein at least one of the plurality of height measuring instruments measures the height of a middle position of the lower surface of the board in a width direction.

4. The component placement machine of claim 1 ,

wherein each of the plurality of height measuring instruments measures a height of the lower surface of the board by coming into contact with the lower surface of the board.

5. The component placement machine of claim 1 ,

wherein the board supporter is provided with a rising and falling body rising and falling below the board arranged at the working position and the plurality of support pins attached to a plurality of pin attachment sections disposed at the rising and falling body and supporting the lower surface of the board, and

wherein each of the plurality of height measuring instruments has a shape allowing attachment to at least one of the plurality of pin attachment sections.

6. The component placement machine of claim 1 , further comprising a plate member coupled to a conveyor unit, the plate member having a height equivalent to the plurality of support pins, wherein the plate member facilitates clamping of the board to the conveyor unit.

7. A component placement method for installing a component by an installation head and with respect to a board arranged at a working position, the component placement method comprising:

a board supporting process of supporting a lower surface of the board arranged at the working position with a board supporter;

pushing up a warped part of the board by a plurality of fixed-height support pins in a case where the board has a warpage of downward curvature;

a height measurement process of measuring heights of a plurality of portions of the lower surface of the board with a plurality of height measuring instruments attached to the board supporter in a case where the board has a warpage of upward curvature; and

a component installation process of installing the component on the board by performing control of a height of the installation of the component by the installation head and with respect to the board based on the heights of the plurality of portions.

8. The component placement method of claim 7 ,

wherein a shape of the board is estimated based on the heights of the plurality of portions and the control of the height of the installation of the component by the installation head and with respect to the board is performed based on the shape of the board in the component installation process.

9. The component placement method of claim 7 , further comprising: clamping the board to a conveyor unit via a plate member coupled to the conveyor, the plate member having a height equivalent to the plurality of support pins.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2017
From: YAMAMOTO, SHINJI; SAKURAI, KOJI; FUJIWARA, HIROYUKI
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 042940/0880 →
Priority Claims (1)
JP 2016-112331 · Jun 6, 2016 · national
Continuity (1)
Related Publication 20170354068A1 · Dec 7, 2017