Method for temporary bonding workpiece and adhesive
A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.
1. A method for temporary bonding workpiece, comprising:
performing a combining step, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece;
performing a bonding step, wherein the substrate and the workpiece are bonded by the adhesive layer;
performing a processing step, wherein the workpiece is processed; and
performing a debonding step, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate;
wherein the adhesive layer is formed by an adhesive, the adhesive comprises a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %, the polymer is polyimide or a copolymer of amic acid/imide, a content of a hydroxyl-containing unit of a skeleton of the polymer is in a range of 5 wt % to 45 wt %, a content of an aliphatic ether-containing unit or a siloxane-containing unit of the skeleton of the polymer is in a range of 5 wt % to 40 wt %, and a cyclization ratio of the polymer is greater than or equal to 90%.
2. The method for temporary bonding workpiece of claim 1 , wherein the combining step comprises:
performing a coating step, wherein the adhesive is coated on the surface of the substrate and/or the workpiece; and
performing a heating step, wherein the adhesive is heated so as to convert the adhesive into the adhesive layer.
3. The method for temporary bonding workpiece of claim 1 , wherein the combining step comprises:
providing a composite film, wherein the composite film comprises a detachable substrate and an adhesive film, the adhesive film is disposed on a surface of the detachable substrate, and the adhesive film is obtained by the adhesive coated on the surface of the detachable substrate and then dried; and
performing a laminating step, wherein the surface of the substrate and/or the workpiece is contacted with the adhesive film of the composite film and heated so as to transfer the adhesive film to the surface of the substrate and/or the workpiece and convert into the adhesive layer.
4. The method for temporary bonding workpiece of claim 1 , further comprises:
performing a dissolving step, wherein the adhesive layer remained on the workpiece is dissolved and removed by a cleaning solvent after the debonding step.
5. The method for temporary bonding workpiece of claim 4 , wherein the solubility parameter of the cleaning solvent ranges from 9.6 to 12.8.
6. The method for temporary bonding workpiece of claim 1 , wherein the workpiece is a chip, a wafer or a micro device for semiconductor manufacturing.
7. The method for temporary bonding workpiece of claim 1 , wherein the aliphatic ether-containing unit is a poly aliphatic ether unit.
8. The method for temporary bonding workpiece of claim 1 , wherein the siloxane-containing unit is a polysiloxane unit.
9. The method for temporary bonding workpiece of claim 1 , wherein the light absorbing material is carbon black, titanium black, iron oxide, titanium nitride, an organic pigment or a dye.
10. An adhesive, comprising:
a polymer, wherein a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, the polymer is polyimide or a copolymer of amic acid/imide, a content of a hydroxyl-containing unit of a skeleton of the polymer is in a range of 5 wt % to 45 wt %, a content of an aliphatic ether-containing unit or a siloxane-containing unit of the skeleton of the polymer is in a range of 5 wt % to 40 wt %, and a cyclization ratio of the polymer is greater than or equal to 90%; and
a light absorbing material, wherein a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.
11. The adhesive of claim 10 , wherein the hydroxyl-containing unit comprises a structure represented by formula (I-1), formula (I-2), formula (I-3), formula (I-4) or formula (I-5):
in formula (I-1) and formula (I-5), wherein each X is independently a single bond or a divalent organic group.
12. The adhesive of claim 11 , wherein each X is independently the single bond, a alkylene group of 1 to 4 carbon atoms, —CO—, —COO—, —O—, —SO 2 — or C(CF 3 ) 2 .
13. The adhesive of claim 10 , wherein the aliphatic ether-containing unit is a poly aliphatic ether unit.
14. The adhesive of claim 13 , wherein the poly aliphatic ether unit comprises a segment represented by formula (II-1) or formula (II-2):
wherein m1 is an integer from 1 to 22, and m2 is an integer from 1 to 22.
15. The adhesive of claim 10 , wherein the siloxane-containing unit is a polysiloxane unit.
16. The adhesive of claim 15 , wherein the polysiloxane unit comprises a segment represented by formula (III-1):
wherein each R 1 is independently a methyl or a phenyl, n1 is an integer from 0 to 5.
17. The adhesive of claim 10 , wherein the light absorbing material is carbon black, titanium black, iron oxide, titanium nitride, an organic pigment or a dye.