Light-emitting module manufacturing method and display device

1. A display device comprising:

a support frame; and

a plurality of light-emitting cabinets including a plurality of light-emitting modules disposed on the support frame,

wherein each of the plurality of light-emitting modules includes a substrate, a light-emitting unit on the substrate, and a black matrix disposed on the substrate to surround the light-emitting unit, and the light-emitting unit has a width of less than 500 μm,

wherein the light-emitting unit includes:

a first light-emitting device mounted directly on the substrate and configured to emit a red wavelength;

a second light-emitting device mounted directly on the substrate and configured to emit a green wavelength;

a third light-emitting device mounted directly on the substrate and configured to emit a blue wavelength; and

a molding part covering the first to third light-emitting devices,

wherein each of the first to third light-emitting devices has a width of 200 μm or less,

the light-emitting unit and the black matrix are a chip on board (COB) type, and

wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is less than 50% of a height of a sapphire substrate of each of the first to third light-emitting devices.

2. The display device of claim 1 , wherein

the support frame includes one flat surface in direct contact with the plurality of light-emitting modules, a plurality of openings passing through the other surface from the one surface, and outer side surfaces,

wherein the outer side surfaces include a plurality of protrusions and a plurality of grooves thereon.

3. The display device of claim 1 , wherein four edges of the substrate protrudes outward beyond four edges of the support frame, and a distance between an end portion of edges of the plurality of light-emitting modules and an end portion of an edge of the support frame is 0.5 to 2.0 mm.

4. The display device of claim 2 , further comprising a driving circuit disposed on a lower surface of the plurality of light-emitting modules,

wherein the plurality of openings are disposed at each of the plurality of light-emitting cabinets, and the plurality of openings face the driving circuit.

5. The display device of claim 1 , wherein the plurality of light-emitting cabinets include first and second light-emitting cabinets adjacent to each other,

wherein the first light-emitting cabinet includes a first fastening part disposed on the other surface of the support frame and a protrusion disposed along an outer side surface thereof, and the second light-emitting cabinet includes a second fastening part disposed on the other surface of the support frame and a slit groove disposed along an outer side surface thereof, wherein the first and second fastening parts have holes facing each other, and include a fastening member passing through the hole, and

the protrusion is in contact with the slit groove.

6. The display device of claim 2 , wherein the first to third light-emitting devices are disposed at a distance of 50 μm or more.

7. The display device of claim 2 , wherein a distance between the first to third light-emitting devices and a side surface of the molding part closest to the first to third light-emitting devices is 25 μm or more.

8. The display device of claim 1 , wherein a cross-sectional thickness of the black matrix corresponds to a cross-sectional thickness of the light-emitting unit.

9. The display device of claim 2 , wherein the molding part includes a black filler.

10. A method of manufacturing a light-emitting module, comprising:

aligning a plurality of first to third light-emitting devices on a first carrier film;

forming a molding layer on the first carrier film and the plurality of first to third light-emitting devices;

forming a plurality of light-emitting units by cutting the molding layer; and

mounting the plurality of light-emitting units on a substrate,

wherein a black matrix is disposed between the plurality of light-emitting units,

wherein the light-emitting unit includes:

a first light-emitting device mounted directly on the substrate and configured to emit a red wavelength;

a second light-emitting device mounted directly on the substrate and configured to emit a green wavelength;

a third light-emitting device mounted directly on the substrate and configured to emit a blue wavelength; and

a molding part covering the first to third light-emitting devices,

wherein each of the first to third light-emitting devices has a width of 200 μm or less,

the light-emitting unit and the black matrix are a chip on board (COB) type, and

wherein a height between an upper surface of the molding part and upper surfaces of the first to third light-emitting devices is less than 50% of a height of a sapphire substrate of each of the first to third light-emitting devices.

11. The method of manufacturing the light-emitting module of claim 10 , further comprising:

aligning the plurality of light-emitting units to a second carrier film between the forming of the plurality of light-emitting units and the mounting of the plurality of light-emitting units; and

forming a light-emitting device block by forming the black matrix between the plurality of light-emitting units on the second carrier film;

wherein the plurality of light-emitting units correspond to the light-emitting device block.

12. The method of manufacturing the light-emitting module of claim 10 , wherein forming the black matrix on the substrate and the plurality of light-emitting units occurs after the mounting of the plurality of light-emitting units.

13. The method of manufacturing the light-emitting module of claim 10 , wherein the first to third light-emitting devices are disposed to be spaced apart from each other at a distance of 50 μm or more in the aligning of the plurality of first to third light-emitting devices on the first carrier film.