Current handling in legs and anchors of RF-switch
The present invention generally relates to a mechanism for making the anchor of the MEMS switch more robust for current handling. The disclosure includes a modified leg and anchor design that allows for larger currents to be handled by the MEMS switch.
1. A MEMS device, comprising:
a substrate having a plurality of electrodes disposed therein, wherein the plurality of electrodes include at least an anchor electrode, a pull-down electrode and an RF electrode;
an insulating layer disposed over the substrate and the pull-down electrode;
a switching element movable from a position spaced a first distance from the RF electrode and a second distance from the RF electrode that is different from the first distance, wherein the switching element includes:
a bottom layer;
a top layer; and
a plurality of vias connecting the bottom layer to the top layer, wherein the switching element includes a first anchor portion, a first leg portion and a bridge portion, wherein the plurality of vias are disposed in the first anchor portion and the bridge portion, wherein the first anchor portion is coupled to the anchor electrode.
2. The MEMS device of claim 1 , wherein the first anchor portion includes a portion of the bottom layer, a portion of the top layer, at least one first via connecting the top layer to the bottom layer, and at least one second via connecting the bottom layer to the anchor electrode.
3. The MEMS device of claim 2 , further comprising an anchor contact disposed between the anchor electrode and the at least one second via.
4. The MEMS device of claim 3 , further comprising a dielectric layer coupled to a top surface of the top layer.
5. The MEMS device of claim 4 , wherein the anchor electrode, the anchor contact, the at least one second via, the bottom layer, the at least one first via, and the top layer are all vertically aligned when viewed from a cross-sectional view.
6. The MEMS device of claim 5 , wherein the plurality of electrodes include a second anchor electrode.
7. The MEMS device of claim 6 , wherein the switching element includes a second anchor portion and wherein the second anchor portion includes a portion of the bottom layer, a portion of the top layer, the at least one first via connecting the top layer to the bottom layer, and the at least one second via connecting the bottom layer to the second anchor electrode.
8. A MEMS device comprising:
a substrate having a plurality of electrodes disposed therein, wherein the plurality of electrodes include at least an anchor electrode, a pull-down electrode and an RF electrode;
an anchor contact disposed on the anchor electrode;
an insulating layer disposed over the substrate and the pull-down electrode;
a switching element movable from a position spaced a first distance from the RF electrode and a second distance from the RF electrode that is different from the first distance, wherein the switching element includes:
a bottom layer;
a top layer; and
a plurality of vias connecting the bottom layer to the top layer, wherein the switching element is enclosed in a cavity; and
a cavity sidewall in contact with the bottom layer, the top layer, and the anchor contact, wherein the cavity sidewall is electrically coupled to the bottom layer, the top layer, and the anchor contact.
9. The MEMS device of claim 8 , wherein the plurality of electrodes include a second anchor electrode.
10. The MEMS device of claim 9 , wherein a second anchor contact is disposed on the second anchor electrode, wherein the cavity sidewall is in contact with the bottom layer, the top layer, and the second anchor contact.
11. The MEMS device of claim 10 , further comprising a via connecting the bottom layer to the anchor contact.
12. A MEMS device, comprising:
a substrate having a plurality of electrodes disposed therein, wherein the plurality of electrodes include at least an anchor electrode, a pull-down electrode and an RF electrode;
an anchor contact disposed on the anchor electrode;
an insulating layer disposed over the substrate and the pull-down electrode;
a switching element movable from a position spaced a first distance from the RF electrode and a second distance from the RF electrode that is different from the first distance, wherein the switching element includes:
a bottom layer;
a top layer; and
a plurality of vias connecting the bottom layer to the top layer, wherein the switching element includes a first anchor portion, a first leg portion and a bridge portion, wherein the plurality of vias are disposed in the first anchor portion and the bridge portion, wherein the anchor portion is coupled to the anchor electrode; and
a cavity sidewall in contact with the bottom layer, the top layer, and the anchor contact, wherein the cavity sidewall is electrically coupled to the bottom layer, the top layer, and the anchor contact.
13. The MEMS device of claim 12 , wherein the first anchor portion includes a portion of the bottom layer, a portion of the top layer, at least one first via connecting the top layer to the bottom layer, and at least one second via connecting the bottom layer to the anchor electrode.
14. The MEMS device of claim 13 , further comprising the anchor contact disposed between the anchor electrode and the at least one second via.
15. The MEMS device of claim 14 , further comprising a dielectric layer coupled to a top surface of the top layer.
16. The MEMS device of claim 15 , wherein the anchor electrode, the anchor contact, the at least one second via, the bottom layer, the at least one first via, and the top layer are all vertically aligned when viewed from a cross-sectional view.
17. The MEMS device of claim 16 , wherein the plurality of electrodes include a second anchor electrode.
18. The MEMS device of claim 17 , wherein the switching element includes a second anchor portion and wherein the second anchor portion includes a portion of the bottom layer, a portion of the top layer, at least one first via connecting the top layer to the bottom layer, and at least one second via connecting the bottom layer to the second anchor electrode.
19. The MEMS device of claim 12 , wherein the plurality of electrodes include a second anchor electrode.
20. The MEMS device of claim 19 , wherein a second anchor contact is disposed on the second anchor electrode, wherein the cavity sidewall is in contact with the bottom layer, the top layer, and the second anchor contact.