Ultra small molded module integrated with die by module-on-wafer assembly
Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.
1. An electrical package comprising:
a die with a redistribution layer on at least one surface of the die;
a molded module mounted to the die, wherein the molded module comprises:
a mold layer having a first surface and a second surface that is opposite to the first surface, and wherein the mold layer has a first width that is smaller than a second width of the die; and
a plurality of components encapsulated within the mold layer, wherein each of the components include terminals that are substantially coplanar with the first surface of the mold layer, and wherein the terminals are electrically coupled to the redistribution layer on the die.
2. The electrical package of claim 1 , wherein the terminals in the molded module are electrically coupled to the redistribution layer on the die with solder bumps.
3. The electrical package of claim 1 , wherein the terminals in the molded module are electrically coupled to the redistribution layer on the die with an anisotropic film or paste.
4. The electrical package of claim 1 , further comprising: a package substrate coupled to the die with first level interconnects.
5. The electrical package of claim 4 , wherein the molded module is positioned between the die and the package substrate.
6. The electrical package of claim 5 , further comprising an interposer formed between the die and the package substrate, wherein the interposer forms a cavity that accommodates the molded module.
7. The electrical package of claim 4 , wherein the first level interconnects are wire bonds.
8. The electrical package of claim 7 , wherein the die is positioned between the molded module and the package substrate.