Component-embedded substrate and method for manufacturing component-embedded substrate
A component-embedded substrate includes a laminate and first and second components. The laminate includes resin layers each made of thermoplastic that are laminated together. The first and second components are embedded in the laminate. The first component has a length in the lamination direction that is greater than a length of the first component in a first direction orthogonal or substantially orthogonal to the lamination direction. The first and second components are disposed adjacent to each other in the first direction, and are disposed at respective positions overlapping with each other as viewed from the first direction. A distance between the first and second components in the first direction is less than the length of the first component in the lamination direction.
1. A component-embedded substrate comprising:
a laminate including a plurality of resin layers each made of thermoplastic and laminated together in a lamination direction; and
a first component and a second component embedded in the laminate;
wherein the first component has a length in the lamination direction greater than a length of the first component in a direction orthogonal or substantially orthogonal to the lamination direction;
the first component and the second component are disposed adjacent to each other in a first direction orthogonal or substantially orthogonal to the lamination direction, and are disposed at respective positions overlapping with each other as viewed from the first direction;
a distance between the first component and the second component in the first direction is less than the length of the first component in the lamination direction; and
each of the first component and the second component includes a component body and a plurality of terminal conductors;
the laminate includes external conductors disposed on outer surfaces of the laminate;
each of the plurality of terminal conductors of the first component is connected to a respective one of the external conductors via a first interlayer connection conductor;
each of the plurality of terminal conductors of the second component is connected to a respective one of the external conductors via a second interlayer connection conductor;
the component body of the first component, the plurality of terminal conductors of the first component, and the respective ones of the external conductors connected to the plurality of terminal conductors of the first component are aligned or substantially aligned in the lamination direction of the plurality of resin layers; and
the component body of the second component, the plurality of terminal conductors of the second component, and the respective ones of the external conductors connected to the plurality of terminal conductors of the second component are aligned or substantially aligned in the lamination direction of the plurality of resin layers.
2. The component-embedded substrate according to claim 1 , wherein the distance between the first component and the second component in the first direction is less than the length of the second component in the lamination direction.
3. The component-embedded substrate according to claim 1 , further comprising:
a third component embedded in the laminate and disposed at a position overlapping with the first component as viewed from the first direction; wherein
the third component is disposed on a side opposite to the second component with respect to the first component in the first direction.
4. The component-embedded substrate according to claim 3 , further comprising:
a fourth component embedded in the laminate, the fourth component being disposed adjacent to the first component in a second direction orthogonal or substantially orthogonal to the lamination direction at a position overlapping with the first component as viewed from the second direction; wherein
a distance between the first component and the fourth component in the second direction is less than the length of the first component in the lamination direction.
5. The component-embedded substrate according to claim 4 , wherein the first, second, third, and fourth components are disposed in a two-dimensional array in plan view.
6. The component-embedded substrate according to claim 4 , wherein the first, second, third, and fourth components have a same or substantially a same shape.
7. The component-embedded substrate according to claim 1 , further comprising:
a fourth component embedded in the laminate, the fourth component being disposed adjacent to the first component in a second direction orthogonal to the lamination direction at a position overlapping with the first component as viewed from the second direction; wherein
a distance between the first component and the fourth component in the second direction is less than the length of the first component in the lamination direction.
8. The component-embedded substrate according to claim 1 , wherein the plurality of resin layers are each mainly made of a liquid crystal polymer.
9. The component-embedded substrate according to claim 1 , wherein the first and second components are harder than the laminate.
10. The component-embedded substrate according to claim 1 , wherein the length of the first component in the lamination direction and the length of the second component in the lamination direction are identical or substantially identical.
11. The component-embedded substrate according to claim 1 , wherein a distance, in the first direction, between a surface of the first component on a side opposite to the second component and a surface of the second component on a side opposite to the first component is greater than the length of the component in the lamination direction.
12. The component-embedded substrate according to claim 1 , wherein the first and second components have a same or substantially a same shape.