Single-piece cover for an electronic device
A single-piece cover for an electronic device, said cover including: a heat sink; an antenna; a shielding screen; an electrically insulating synthetic material forming outer surfaces of the cover.
1. A single-piece cover for an electronic device, the cover comprising:
a heatsink;
an antenna;
a shielding screen; and
an electrically-insulating synthetic material forming outside surfaces of the cover, wherein the electrically-insulating synthetic material is overmolded onto the antenna.
2. The cover according to claim 1 , wherein the antenna is connected to electrical connection means arranged so as to be capable of being connected to the electronic device.
3. The cover according to claim 2 , wherein the electrical connection means include a surface contact and/or a contact including a resilient element.
4. The cover according to claim 2 , wherein the electrical connection means include a coaxial cable connector.
5. The cover according to claim 4 , wherein the coaxial cable connector is of a UFL type.
6. The cover according to claim 1 , wherein the shielding screen is connected to equipotential bonding means arranged so as to be capable of being connected to the electronic device.
7. The cover according to claim 6 , wherein the equipotential bonding means for bonding with the electronic device include a compressible conductive foam.
8. The cover according to claim 1 , including mechanical connection means arranged so as to enable the cover to be fastened to the electronic device.
9. The cover according to claim 8 , wherein the mechanical connection means include at least one threaded hole designed for receiving a screw.
10. The cover according to claim 1 , wherein the cover includes a metal structure made of a material including copper.
11. The cover according to claim 10 , wherein the conductors extending between the antenna and the electrical connection means are fastened to the metal structure.
12. The cover according to claim 1 , wherein the antenna is embedded in the synthetic material.
13. The cover according to claim 1 , wherein the synthetic material is deposited by applying a layer of thermoformed plastic or by epoxy paint deposition.
14. A method of manufacturing electronic equipment comprising the following steps:
manufacturing a cover according to claim 1 ;
presenting the electronic device; and
assembling the cover and the electronic device together.