Plasma processing method

1. A plasma processing method, comprising steps of:

preparing a conveying carrier including a holding sheet and a frame provided on a peripheral region of the holding sheet;

adhering the substrate on the holding sheet in an inner region inside the peripheral region to hold the substrate on the conveying carrier;

sagging the holding sheet in the inner region;

setting the conveying carrier on a stage provided within a plasma processing apparatus to contact the holding sheet on the stage so that the holding sheet in the inner region touches the stage before the holding sheet in the peripheral region does; and

plasma processing the substrate,

wherein a sag amount Q of the holding sheet in the inner region is controlled to be greater than a distortion amount R of the frame in the sagging step.

2. The plasma processing method according to claim 1 , wherein the sagging step is achieved by stretching the holding sheet.

3. The plasma processing method according to claim 2 , wherein the holding sheet is stretched by heating the holding sheet.

4. The plasma processing method according to claim 1 , further comprising steps of:

cooling down the stage; and

keeping the holding sheet in contact with the stage for a predetermined time period.

5. A plasma processing method, comprising steps of:

preparing a conveying carrier including a holding sheet and an annular frame provided on a peripheral region of the holding sheet, by applying the frame with a biasing force in a radial direction for stretching it, adhering the frame on the holding sheet in the peripheral region thereof, and releasing the biasing force from the frame, so as to sag the holding sheet in an inner region inside the peripheral region;

adhering the substrate on the holding sheet in the inner region to hold the substrate on the conveying carrier;

setting the conveying carrier on a stage provided within a plasma processing apparatus to contact the holding sheet on the stage so that the holding sheet in the inner region touches the stage before the holding sheet in the peripheral region does; and

plasma processing the substrate.

6. The plasma processing method according to claim 5 , wherein a sag amount Q of the holding sheet in the inner region is controlled to be greater than a distortion amount R of the frame in the preparing step.

7. The plasma processing method according to claim 5 , further comprising steps of:

cooling down the stage; and

keeping the holding sheet in contact with the stage for a predetermined time period.