Producing strained nanosheet field effect transistors using a phase change material

1. A semiconductor device, comprising:

alternating layers of a channel material and a phase change material, wherein the layers of the phase change material cause a strain in the layers of the channel material to produce strained nanosheet field effect transistors.

2. The semiconductor device of claim 1 , wherein the layers of the phase change material are layers that replaced layers of sacrificial channel material to introduce the strain in the layers of the channel material.

3. The semiconductor device of claim 2 , wherein the sacrificial channel material comprises silicon germanium, and wherein the phase change material comprises germanium antimony telluride.

4. The semiconductor device of claim 3 , wherein the germanium antimony telluride crystallizes into a crystalline germanium antimony telluride based on annealing above 300 degrees Celsius.

5. The semiconductor device of claim 4 , wherein a volume of the crystalline germanium antimony telluride is reduced up to six percent relative to an initial volume of the germanium antimony telluride to cause the strain in the layers of the channel material.

6. The semiconductor device of claim 1 , wherein the channel material comprises silicon, and wherein a channel comprising the channel material is a silicon channel.

7. The semiconductor device of claim 1 , further comprising:

source and drain epitaxial growths on both ends of the layers of the channel material, wherein the source and drain epitaxial growths lock the strain in the layers of the channel material.

8. The semiconductor device of claim 1 , further comprising:

a p-type field effect transistor (pFET) coupled to the alternating layers of the channel material and the phase change material, wherein the strain in the layers of the channel material comprises a compressive strain.

9. A method, comprising:

forming alternating layers of a channel material and a phase change material, wherein the layers of the phase change material cause a strain in the layers of the channel material to produce strained nanosheet field effect transistors.

10. The method of claim 9 , further comprising:

prior to the forming alternating layers of the channel material and the phase change material, forming alternating layers of channel material and sacrificial channel material; and

replacing the layers of sacrificial channel material with the layers of phase change material to form the alternating layers of channel material and the phase change material.

11. The method of claim 10 , wherein the sacrificial channel material comprises silicon germanium, and wherein the phase change material comprises germanium antimony telluride.

12. The method of claim 11 , further comprising:

crystallizing the germanium antimony telluride of the phase change material into a crystalline germanium antimony telluride thereby reducing a volume of the crystalline germanium antimony telluride by at least 6 percent relative to an initial volume of the germanium antimony telluride to cause the strain in the layers of the channel material, wherein the crystallizing is based on annealing the germanium antimony telluride above 300 degrees Celsius.

13. The method of claim 10 , further comprising:

providing a sacrificial gate deposition, wherein the providing the sacrificial gate deposition is performed:

over the alternating layers of the channel material and the sacrificial channel material and prior to the replacing; or

over the alternating layers of the channel material and the phase change material and after the replacing.

14. The method of claim 9 , wherein the channel material comprises silicon, and wherein a channel comprising the channel material is a silicon channel.

15. The method of claim 9 , further comprising:

forming source and drain epitaxial growths on both ends of the layers of the channel material, wherein the forming of the source and drain epitaxial growths on both ends of the layers of the channel material locks the strain in the layers of the channel material.

16. The method of claim 15 , further comprising:

removing the layers of the phase change material, wherein the source and drain epitaxial growths maintain the strain in the layers of the channel material after the removing the layers of the phase change material.

17. The method of claim 9 , further comprising:

forming a p-type field effect transistor (pFET) coupled to the alternating layers of the channel material and the phase change material, wherein the strain comprises a compressive strain.

18. A semiconductor device, comprising:

alternating layers of a channel material and a phase change material, wherein the layers of the phase change material cause a strain in the layers of the channel material to produce strained nanosheet field effect transistors, and wherein the phase change material comprises germanium antimony telluride.

19. The semiconductor device of claim 18 , wherein the germanium antimony telluride crystallizes into a crystalline germanium antimony telluride based on annealing above 300 degrees Celsius and a volume of the crystalline germanium antimony telluride is reduced up to six percent relative to an initial volume the germanium antimony telluride to cause the strain in the layers of the channel material.

20. The semiconductor device of claim 18 , further comprising:

source and drain epitaxial growths on both ends of the layers of the channel material that lock the strain in the layers of the channel material.