LED structures for reduced non-radiative sidewall recombination
LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top current spreading layer, bottom current spreading layer, and active layer between the top current spreading layer and bottom current spreading layer.
1. A light emitting diode (LED) comprising:
a p-n diode layer including:
a top doped layer doped with a first dopant type;
a bottom doped layer doped with a second dopant type opposite the first dopant type; and
an active layer between the top doped layer and the bottom doped layer
wherein the active layer includes one or more quantum well layers and a plurality of quantum barrier layers, wherein the plurality of quantum barrier layers are under tensile strain and the one or more quantum well layers are under compressive strain, and the one or more quantum well layers includes segregated quantum dot clumps.
2. The LED of claim 1 , wherein the quantum dot clumps are In-rich areas in the one or more quantum well layers.
3. The LED of claim 1 , wherein the quantum dot clumps are on the order of 10-20 nm in size.
4. The LED of claim 1 , wherein the quantum dot clumps are characterized as lower band gap regions compared to surrounding regions of the one or more quantum well layers.
5. The LEL of claim 1 , wherein the bottom doped layer comprises a pillar structure with a reduced width relative to a width of the active layer.
6. The LED of claim 1 , wherein the one or more quantum well layers comprise GaInP.
7. The LED of claim 6 , wherein the quantum barrier layers comprise AlGaInP.
8. The LED of claim 6 , wherein the quantum dot clumps are In-rich regions of the GaInP quantum well layers.
9. The LED of claim 8 , wherein the quantum dot clumps are on the order of 10-20 nm in size.
10. The LED of claim 8 , wherein a maximum lateral dimension of the p-n diode layer is 1 to 300 μm.
11. The LED of claim 8 , wherein a maximum lateral dimension of the p-n diode layer is 1 to 20 μm.
12. The LED of claim 11 , wherein the bottom doped layer is p-type.
13. The LED of claim 12 , wherein the bottom doped layer comprises an in-situ Mg dopant concentration of 5×10 17 cm −3 to 1.5×10 18 cm −3 .
14. An electronic device comprising:
a display driver IC; and
a display, wherein the display includes a plurality of pixels, each pixel including a light emitting diode (LED) device that includes a p-n diode layer including:
a top doped layer doped with a first dopant type;
a bottom doped layer doped with a second dopant type opposite the first dopant type; and
an active layer between the top doped layer and the bottom doped layer;
wherein the active layer includes one or more quantum well layers and a plurality of quantum barrier layers, wherein the plurality of quantum barrier layers are under tensile strain and the one or more quantum well layers are under compressive strain, and the one or more quantum well layers includes segregated quantum dot clumps.
15. The electronic device of claim 14 , wherein the p-n diode layer is further characterized by:
the one or more quantum well layers comprise GaInP;
the quantum barrier layers comprise AlGaInP;
the quantum dot clumps are In-rich regions of the GaInP quantum well layers;
the quantum dot clumps are on the order of 10-20 nm in size;
a maximum lateral dimension of the p-n diode layer is 1 to 20 μm; and
the bottom doped layer is p-type.
16. A donor substrate comprising:
a carrier substrate;
an array of light emitting diode (LED) devices secured to the carrier substrate, wherein each LED device includes a p-n diode layer including:
a top doped layer doped with a first dopant type;
a bottom doped layer doped with a second dopant type opposite the first dopant type; and
an active layer between the top doped layer and the bottom doped layer;
wherein the active layer includes one or more quantum well layers and a plurality of quantum barrier layers, wherein the plurality of quantum barrier layers are under tensile strain and the one or more quantum well layers are under compressive strain, and the one or more quantum well layers includes segregated quantum dot clumps.
17. The donor substrate of claim 16 , wherein the p-n diode layer is further characterized by:
the one or more quantum well layers comprise GaInP;
the quantum barrier layers comprise AlGaInP;
the quantum dot clumps are In-rich regions of the GaInP quantum well layers;
the quantum dot clumps are on the order of 10-20 nm in size;
a maximum lateral dimension of the p-n diode layer is 1 to 20 μm; and
the bottom doped layer is p-type.
18. A light emitting diode (LED) comprising:
a p-n diode layer including:
a top doped layer doped with a first dopant type;
a bottom doped layer doped with a second dopant type opposite the first dopant type; and
an active layer between the top doped layer and the bottom doped layer
wherein the active layer includes segregated quantum dot clumps, and the bottom doped layer comprises a pillar structure with a reduced width relative to a width of the active layer.
19. The LED of claim 18 , wherein a maximum lateral dimension of the p-n diode layer is 1 to 20 μm.
20. The LED of claim 18 , wherein the quantum dot clumps are In-rich areas in a quantum well layer.
21. The LED of claim 20 , wherein the quantum dot clumps are on the order of 10-20 nm in size.
22. The LED of claim 20 , wherein the quantum dot clumps are characterized as lower band gap regions compared to surrounding regions of the quantum well layer.