Component carrier and method to produce said component carrier
The invention relates to a component carrier for an electronic device, the component carrier comprising at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, characterized in that the heat spreader layer forms at least an outside section of a casing of said electronic device. Also an electronic device that comprises at least one component carrier according to the invention, as well as a method to produce a respective component carrier are indicated.
1. A component carrier formed of a printed circuit board, an intermediate printed circuit board product, or an IC-substrate disposed in an electronic device wherein the electronic device comprises a casing on the outside of the component carrier wherein the casing further comprises a first component and a second component; and wherein the component carrier is a multi-layer component carrier that further comprises at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier such that the at least one heat-releasing component does not extend through the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, wherein the heat spreader layer is one carrier layer of the multi-layer component carrier and forms the second component of the casing of said electronic device.
2. The component carrier according to claim 1 , wherein the heat spreader layer is arranged as outer carrier layer forming an outside surface of the component carrier.
3. The component carrier according to claim 1 , wherein the at least one embedded heat-releasing component adjoins to the heat spreader layer.
4. The component carrier according to claim 1 , wherein the at least one embedded heat-releasing component is directly mounted on the heat spreader layer.
5. The component carrier according to claim 1 , wherein the heat spreader layer is a core layer made of a solid material.
6. The component carrier according to claim 1 , wherein the heat spreader layer is made of a composite material.
7. The component carrier according to claim 1 , wherein at least one battery is integrated within the component carrier.
8. The component carrier according to claim 1 , wherein the heat spreader layer is at least partly covered by a sealing means that protects the heat spreader layer.
9. The component carrier according to claim 8 , wherein the sealing means at least temporarily protects the heat spreader layer during manufacture.
10. The component carrier according to claim 1 , wherein the heat spreader layer is at least partly covered by a surface-finishing means that is attached to the heat spreader layer and patterns its surface.
11. An electronic device, comprising at least one component carrier according to claim 1 , wherein at least one heat-releasing component is embedded in the component carrier and thermoconductively coupled to a heat spreader layer, wherein the heat spreader layer forms at least a section of the casing of said electronic device.
12. The electronic device according to claim 11 , wherein the at least one heat-releasing component adjoins to or is directly mounted on the heat spreader layer.
13. The electronic device according to claim 11 , wherein the heat-releasing component comprises an inlay structure, preferably an inlay structure made of copper, that enhances heat transfer.
14. The component carrier according to claim 5 , wherein the heat spreader layer is made of metal.
15. The component carrier according to claim 6 , wherein the heat spreader layer is made of a carbon-containing composite material.