IP Library › Granted Patent US 10,717,694
Granted Patent B2
US 10,717,694 · App. 16/099,719 · Granted Jul 21, 2020

Hydrofluoroolefins and methods of using same

Inventors: Sean M. Smith (Woodbury, MN); William M. Lamanna (Stillwater, MN); Michael G. Costello (Afton, MN); Michael J. Bulinski (Stillwater, MN)
Assignee: 3M Innovative Properties Company
C07C43/17C09K5/04C09K5/045C09K5/10C07C43/16C09K2205/112C09K2205/126
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Quick Facts
Patent No.
US 10,717,694
App. No.
16/099,719
Granted
Jul 21, 2020
Kind
B2
Abstract

A hydrofluoroolefin compound is represented by the following general formula (I): where R f is a linear or branched perfluorinated alkyl group containing 2-10 carbon atoms and optionally contains (i) at least one catenated heteroatom selected from O or N; or (ii) a ring structure having 3 to 6 ring carbon atoms that optionally contains one or more catentated heteroatoms selected from O or N.

Claims (15)

1. A hydrofluoroolefin compound represented by the following general formula (I):

wherein R f is a linear or branched perfluorinated alkyl group containing 2-10 carbon atoms and optionally contains: (i) at least one catenated heteroatom selected from O or N; or (ii) a ring structure having 3 to 6 ring carbon atoms that optionally contains one or more catentated heteroatoms selected from O or N.

2. The hydrofluoroolefin compound of claim 1 , wherein R f contains 3-10 carbon atoms.

3. The hydrofluoroolefin compound according to claim 1 , wherein R f is linear.

4. The hydrofluoroolefin compound according to claim 1 , wherein R f is branched.

5. The hydrofluoroolefin compound according to claim 1 , wherein R f contains at least one catenated heteroatom selected from O or N.

6. A working fluid comprising hydrofluoroolefin compound according to claim 1 , wherein the hydrofluroolefin compound is present in the working fluid at an amount of at least 25% by weight based on the total weight of the working fluid.

7. An apparatus for heat transfer comprising:

a device; and

a mechanism for transferring heat to or from the device, the mechanism comprising a heat transfer fluid that comprises the working fluid according to claim 6 .

8. The apparatus for heat transfer according to claim 7 , wherein the device is selected from a microprocessor, a semiconductor wafer used to manufacture a semiconductor device, a power control semiconductor, an electrochemical cell, an electrical distribution switch gear, a power transformer, a circuit board, a multi-chip module, a packaged or unpackaged semiconductor device, a fuel cell, and a laser.

9. The apparatus for heat transfer according to claim 8 , wherein the mechanism for transferring heat is a component in a system for maintaining a temperature or temperature range of an electronic device.

10. A method of transferring heat comprising:

providing a device; and

transferring heat to or from the device using a heat transfer fluid that comprises the working fluid according to claim 6 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2019
From: SMITH, SEAN M; LAMANNA, WILLIAM M.; COSTELLO, MICHAEL G.; BULINSKI, MICHAEL J.
To: 3M INNOVATIVE PROPERTIES COMPANY
Reel/Frame 047947/0827 →
Continuity (2)
Provisional Application 62333330 · May 9, 2016
Related Publication 20190185402A1 · Jun 20, 2019
Cited By (1)
US 12,729,332