IP Library Granted Patent US 10,721,822
Granted Patent B2
US 10,721,822 · App. 16/182,244 · Granted Jul 21, 2020

Electric connection structure and electric connection member

Inventors: Junya Sato (Tokyo, JP); Ryosuke Mitsui (Tokyo, JP)
Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
H05K3/1291C09D11/037C09D11/14C09D11/322C09D11/38C09D11/52H01R4/026H01R4/04H01R4/70H05K1/111H05K3/0011H05K3/321H05K3/381H05K3/382H05K3/403H05K3/4076H01R12/52H05K2201/0257H05K2201/09472H05K2201/10659Y02P70/611
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Quick Facts
Patent No.
US 10,721,822
App. No.
16/182,244
Granted
Jul 21, 2020
Kind
B2
Abstract

There is provided an electric connection member having a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect, wherein the electric connection member is provided with a recess that opens at a side of the insulating adhesive layer, the conductive interconnect is disposed in the recess, a metal nano-ink is disposed on the conductive interconnect, and all of the metal nano-ink is contained inside the recess.

Claims (17)

1. A mounting structure of an electronic component assembly in which an electronic component having an electrode is mounted on an electric connection member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,

wherein the substrate and the insulating adhesive layer form a laminate body,

the laminate body is provided with a recess that opens at a side of the insulating adhesive layer,

the conductive interconnect is disposed in the recess,

a metal nano-ink is disposed on the conductive interconnect in the recess,

all of the metal nano-ink is contained inside the recess,

the electronic component is disposed relative to the electric connection member such that the electrode is inserted into the recess and a surface of the insulating adhesive layer is in contact with a surface of the electronic component,

the conductive interconnect and the electrode inserted into the recess are electrically connected to each other through the metal nano-ink disposed on the conductive interconnect and sintered in the recess,

the surface of the insulating adhesive layer adheres to the surface of the electronic component,

the recess has a depth greater than a thickness of the insulating adhesive layer,

the recess has a bottom surface located in the substrate, and

the conductive interconnect is disposed on the bottom surface of the recess.

2. The electric connection member according to claim 1 , wherein the substrate is a flexible substrate.

3. An intermediate member used for producing the electric connection member according to claim 1 , the intermediate member comprising a substrate, an insulating adhesive layer provided on the substrate, and a conductive interconnect,

wherein the substrate and the insulating adhesive layer form a laminate body,

the laminate body is provided with a recess that opens at a side of the insulating adhesive layer, and

the conductive interconnect is disposed in the recess.

Priority Claims (1)
JP 2015-036546 · Feb 26, 2015 · national
Continuity (3)
Continuation 15613752 · Jun 5, 2017
Continuation PCTJP2015083460 · Nov 27, 2015
Related Publication 20190075658A1 · Mar 7, 2019
Cited By (2)
US 12,211,809 US 12,564,086