Conductive adhesive
A conductive adhesive contains a thermosetting resin (A), a conductive filler (B), and a filling-performance improver (C). The thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group. The filling-performance improver (C) contains an organic salt. The conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin.
1. A conductive adhesive, comprising:
a thermosetting resin (A);
a conductive filler (B); and
a filling-performance improver (C), wherein
the thermosetting resin (A) contains a first resin component (A1) having a first functional group, and a second resin component (A2) having a second functional group that reacts with the first functional group, and
the filling-performance improver (C) contains an organic salt, and
the conductive adhesive contains from 40 to 140 parts by mass of the filling-performance improver (C) relative to 100 parts by mass of the thermosetting resin (A).
2. The conductive adhesive of claim 1 , wherein the filling-performance improver (C) is a metal salt of phosphinic acid.
3. The conductive adhesive of claim 2 , wherein the metal salt of phosphinic acid has a median size of 5 μm or less.
4. The conductive adhesive of claim 1 , wherein
the first functional group is an epoxy group, and
the second resin component (A2) has a glass transition temperature from 5° C. to 100° C., a number average molecular weight from 10,000 to 50,000, and a functional group that reacts with the epoxy group.
5. The conductive adhesive of claim 1 , wherein the second resin component (A2) is an urethane-modified polyester resin.
6. An electromagnetic-wave shielding film, comprising:
a protective layer; and
a conductive adhesive layer, wherein the conductive adhesive layer contains the conductive adhesive of claim 1 .
7. A printed wiring board reinforcing plate, comprising:
a conductive reinforcing plate; and
a conductive adhesive layer provided on at least one of surfaces of the conductive reinforcing plate, wherein the conductive adhesive layer contains the conductive adhesive of claim 1 .
8. A shield printed wiring board, comprising:
a base member including a ground circuit;
a cover lay covering the ground circuit and having an opening through which a portion of the ground circuit is exposed; and
an electromagnetic-wave shielding film bonded to the cover lay, wherein the electromagnetic-wave shielding film includes a conductive adhesive layer containing the conductive adhesive of claim 1 .
9. A printed wiring board, comprising:
a base member including a ground circuit provided on at least one of surfaces of the base member;
a cover lay covering the ground circuit and having an opening through which a portion of the ground circuit is exposed; and
a conductive reinforcing plate facing the ground circuit;
a conductive adhesive layer joining the ground circuit and the conductive reinforcing plate together such that the ground circuit and the conductive reinforcing plate are electrically continuous; and
an electronic component arranged on a portion of the base member corresponding to the conductive reinforcing plate,
wherein the conductive adhesive layer contains the conductive adhesive of claim 1 .