Coating and developing method and coating and developing apparatus
A coating and developing method includes: a step that applies a resist containing a metal to a front surface of a substrate to form a resist film, and exposes the resist film; a developing step that supplies a developer to the front surface of the substrate to develop the resist film; and a step that forms, before the developing step, a first protective film on a peripheral part of the substrate on which the resist film is not formed, so as to prevent the developer from coming into contact with the peripheral part of the substrate, wherein the first protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.
1. A coating and developing apparatus comprising:
a control unit configured to control a resist film forming module, a developing module and a protective film forming module;
the resist film forming module configured to apply a resist containing a metal to a front surface of a substrate to form a resist film;
the developing module configured to supply a developer to the front surface of the substrate to develop the resist film having been exposed by an exposure apparatus connected to the coating and developing apparatus; and
the protective film forming module configured to form a protective film, after exposure and before development of the resist film, on a peripheral part of the substrate on which the resist film is not formed, wherein the protective film prevents the developer from coming into contact with the peripheral part of the substrate, and wherein the protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.
2. A coating and developing apparatus comprising:
a control unit configured to control a resist film forming module, a developing module and an adhesion prevention liquid supplying unit;
the resist film forming module configured to apply a resist containing a metal to a front surface of a substrate to form a resist film;
the developing module configured to supply a developer to the front surface of the substrate to develop the resist film having been exposed by an exposure apparatus connected to the coating and developing apparatus; and
the adhesion prevention liquid supplying unit configured to supply, after exposure of the resist film and during a time period from before the developer is supplied to the peripheral part of the substrate until the developer is removed from the front surface of the substrate, an adhesion prevention liquid for preventing adhesion of the metal along a circumference of the substrate to a peripheral part of the substrate on which the resist film is not formed, wherein the adhesion prevention liquid is supplied at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.