Display panel and fabrication method, and display device thereof

1. A display panel, comprising:

a display region and a non-display region, wherein the display region includes:

a first substrate, containing an N-type semiconductor layer including a plurality of protrusions and a plurality of light-emitting diodes, wherein:

each light-emitting diode includes an island-shaped structure, the island-shaped structure includes a protrusion of the plurality of protrusions of the N-type semiconductor layer, a light-emitting layer over the protrusion, and a P-type semiconductor layer over the light-emitting layer; and

an N electrode and a plurality of P electrodes, wherein:

the N electrode has a mesh structure, the island-shaped structure is disposed in a mesh opening of the mesh structure, the N electrode and the island-shaped structure are disposed on a same side of the N-type semiconductor layer, and the N electrode is electrically connected to the N-type semiconductor layer, and

the plurality of P electrodes are disposed, in a one-to-one correspondence with the plurality of light-emitting diodes, on a side opposite to the N-type semiconductor layer, and each P electrode of the plurality of P electrodes is electrically connected to the P-type semiconductor layer,

wherein the first substrate further includes a light-shading portion, the light-shading portion includes a plurality of openings, and the island-shaped structure is disposed in an opening of the plurality of openings of the light-shading portion.

2. The display panel according to claim 1 , wherein:

the N electrode includes an oxide layer, wherein the oxide layer is disposed on a surface of the N electrode opposite to the N-type semiconductor layer.

3. The display panel according to claim 1 , further including:

a color film substrate disposed on a side of the first substrate.

4. The display panel according to claim 1 , further including:

a first current spreading layer and a plurality of second current spreading layers, wherein:

the first current spreading layer is integrally disposed and has a planar shape,

the plurality of second current spreading layers are independent of each other,

the first current spreading layer is disposed over a side of the N-type semiconductor layer opposite to the P-type semiconductor layer, and

each second current spreading layer of the plurality of second current spreading layers is disposed over a side of the P-type semiconductor layer opposite to the N-type semiconductor layer.

5. The display panel according to claim 1 , wherein:

the first substrate further includes a protection layer, wherein the protection layer covers the plurality of island-shaped structures and exposes the plurality of P electrodes.

6. The display panel according to claim 1 , wherein:

the N-type semiconductor layer is made of n-GaN,

the P-type semiconductor layer is made of p-GaN, and

the light-emitting layer includes an In y Ga (1-y) N layer and a GaN layer, wherein y=0.015-0.25.

7. The display panel according to claim 1 , wherein:

an area of an orthogonal projection of the island-shaped structure onto the first substrate is S, wherein 25 μm 2 ≤S≤10000 μm 2 .

8. The display panel according to claim 1 , wherein:

the N electrode is made of a metal, and

the P electrode is made of a metal.

9. A display device, comprising: a display panel according to claim 1 .

10. A display panel, comprising:

a display region and a non-display region, wherein the display region includes:

a first substrate, containing an N-type semiconductor layer including a plurality of protrusions and a plurality of light-emitting diodes, wherein:

each light-emitting diode includes an island-shaped structure, the island-shaped structure includes a protrusion of the plurality of protrusions of the N-type semiconductor layer, a light-emitting layer over the protrusion, and a P-type semiconductor layer over the light-emitting layer; and

an N electrode and a plurality of P electrodes, wherein:

the N electrode has a mesh structure, the island-shaped structure is disposed in a mesh opening of the mesh structure, the N electrode and the island-shaped structure are disposed on a same side of the N-type semiconductor layer, and the N electrode is electrically connected to the N-type semiconductor layer, and

the plurality of P electrodes are disposed, in a one-to-one correspondence with the plurality of light-emitting diodes, on a side opposite to the N-type semiconductor layer, and each P electrode of the plurality of P electrodes is electrically connected to the P-type semiconductor layer,

wherein:

the first substrate further includes a first auxiliary N electrode, wherein the first auxiliary N electrode and the island-shaped structure are disposed on an opposite side of the N-type semiconductor layer; and

the N-type semiconductor layer contains first through-holes, wherein the first auxiliary N electrode is electrically connected to the N electrode through the first through-holes.

11. The display panel according to claim 10 , wherein:

an orthogonal projection of the N electrode onto the N-type semiconductor layer have a same shape as an orthogonal projection of the first auxiliary N electrode onto the N-type semiconductor layer.

12. The display panel according to claim 11 , wherein:

the first substrate further includes a planar second auxiliary N electrode, wherein the second auxiliary N electrode covers a surface of the first auxiliary N electrode opposite to the N-type semiconductor layer.

13. A display panel, comprising:

a display region and a non-display region, wherein the display region includes:

a first substrate, containing an N-type semiconductor layer including a plurality of protrusions and a plurality of light-emitting diodes, wherein:

each light-emitting diode includes an island-shaped structure, the island-shaped structure includes a protrusion of the plurality of protrusions of the N-type semiconductor layer, a light-emitting layer over the protrusion, and a P-type semiconductor layer over the light-emitting layer; and

an N electrode and a plurality of P electrodes, wherein:

the N electrode has a mesh structure, the island-shaped structure is disposed in a mesh opening of the mesh structure, the N electrode and the island-shaped structure are disposed on a same side of the N-type semiconductor layer, and the N electrode is electrically connected to the N-type semiconductor layer, and

the plurality of P electrodes are disposed, in a one-to-one correspondence with the plurality of light-emitting diodes, on a side opposite to the N-type semiconductor layer, and each P electrode of the plurality of P electrodes is electrically connected to the P-type semiconductor layer; and

a driving array layer including a plurality of thin film transistors, wherein:

a thin film transistor of the plurality of thin film transistors includes a gate, a source, and a drain,

the plurality of thin film transistors are electrically connected in a one-to-one correspondence with the plurality of light-emitting diodes, and

the drain of the thin film transistor is electrically connected to the P electrode of a corresponding light-emitting diode.

14. The display panel according to claim 13 , further including:

a plurality of connection parts, wherein the drain of the thin film transistor is electrically connected to the P electrode of the corresponding light-emitting diode through a connection part of the plurality of connection parts.

15. The display panel according to claim 14 , wherein:

the connection part is made of an anisotropic conductive paste.

16. The display panel according to claim 13 , wherein:

the first substrate further includes an N-electrode signal bus disposed in the non-display region, wherein the N-electrode signal bus is disposed surrounding the display region and is electrically connected to the N-electrode.