Hard coating for cutting tool
A hard coating includes a thin film layer which has a total thickness of 0.5-10 μm and has an overall composition of Al 1-a-b Ti a Me b N (0.2<a≤0.6, 0<b≤0.15), where Me is a nitride constituent element having a thermal expansion coefficient of greater than 2.7×10 −6 /° C. and less than 9.35×10 −6 /° C., wherein the thin film layer has a structure in which a nano-multilayered-structure of thin layers A, B and C, thin layer B being disposed between thin layer A and thin layer C, is repeatedly laminated at least once.
1. A hard coating formed on the surface of a base material for a cutting tool by a PVD method,
the hard coating comprising a thin film layer which has a total thickness of 0.5-10 μm and has an overall composition of Al 1-a-b Ti a Me b N (0.2<a≤0.6, 0<b≤0.15),
wherein the Me is a nitride constituent element having a thermal expansion coefficient of greater than 2.7×10 −6 /° C. and less than 9.35×10 −6 /° C.,
wherein the thin film layer has a nano-multilayered-structure of thin layers A, B and C, a thin layer B being disposed between a thin layer A and a thin layer C as a A-B-C layer or a C-B-A layer, the A-B-C layer or the C-B-A layer being repeatedly laminated at least once,
wherein,
the thin layer A has a composition of Ti 1-a Al a N (0.3≤a<0.7),
the thin layer B has a composition of Ti 1-y-z Al y Me z N (0.3≤y<0.7, 0.01≤z<0.5), and
the thin layer C has a composition of Al 1-x Ti x N (0.3≤x<0.7),
wherein kA is the thermal expansion coefficient of the thin layer A, kB is the thermal expansion coefficient of the thin layer B, and kC is the thermal expansion coefficient of the thin layer C, the thin film layer satisfying the relationship of kA>kB>kC,
wherein the difference in the thermal expansion coefficients of Me nitrides and the thermal expansion coefficients of the AlN and TiN is at least 1.0×10 −6 /° C.
2. The hard coating of claim 1 , wherein the Me comprises one or more selected from among Si and Groups 4a, 5a, and 6a elements.
3. The hard coating of claim 1 , wherein the Me comprises one or more selected from among Si, Zr, Hf, V, Ta, and Cr.